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UCC28C40, UCC28C41, UCC28C42, UCC28C43, UCC28C44, UCC28C45
UCC38C40, UCC38C41, UCC38C42, UCC38C43, UCC38C44, UCC38C45

SLUS458E -- AUGUST 2001 -- REVISED OCTOBER 2010

BiCMOS LOW-POWER CURRENT-MODE PWM CONTROLLER
FEATURES

DESCRIPTION

D Enhanced Replacement for UC3842A Family
D
D
D
D
D
D
D
D
D
D

UCC38C4x family is a high-performance currentmode PWM controller. It is an enhanced BiCMOS version with pin-for-pin compatibility to the industry standard UC384xA family and UC384x family of PWM controllers. In addition, lower startup voltage versions of 7 V are offered as
UCC38C40 and UCC38C41.

With Pin-to-Pin Compatibility
1-MHz Operation
50-μA Standby Current, 100-μA Maximum
Low Operating Current of 2.3 mA at 52 kHz
Fast 35-ns Cycle-by-Cycle Overcurrent
Limiting
±1-A Peak Output Current
Rail-to-Rail Output Swings with 25-ns Rise and 20-ns Fall Times
±1% Initial Trimmed 2.5-V Error Amplifier
Reference
Trimmed Oscillator Discharge Current
New Under Voltage Lockout Versions
MSOP-8 Package Minimizes Board Space

Providing necessary features to control fixed frequency, peak current-mode power supplies, this family offers the following performance advantages. The device offers high-frequency operation up to 1 MHz with low start-up and operating currents, thus minimizing start-up loss and low operating power consumption for improved efficiency. The device also features a very fast current-sense-to-output delay time of
35 ns and a ±1 A peak output current capability with improved rise and fall times for driving large external MOSFETs directly.

APPLICATIONS

D Switch-Mode Power Supplies
D dc-to-dc Converters
D Board Mount Power Modules

The UCC38C4x family is offered in 8-pin packages, MSOP (DGK), SOIC (D) and PDIP (P).

FUNCTIONAL BLOCK DIAGRAM
5.0 V

8

VREF

7

GND

6

+

VDD

5

UVLO

OUT

+

VREF

VREF
GOOD LOGIC

RT/CT

4

OSC
(NOTE)
2.5 V

FB

+

ERROR AMP

T

2R

S

2
R

COMP

1

CS

1V

Q

R

Q

3
Note: Toggle flip--flop used only in UCC38C41, UCC38C44, and UCC38C45.

UDG--99139

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters.

Copyright © 2003 -- 2010, Texas Instruments Incorporated

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1

UCC28C40, UCC28C41, UCC28C42, UCC28C43, UCC28C44, UCC28C45
UCC38C40, UCC38C41, UCC38C42, UCC38C43, UCC38C44, UCC38C45
SLUS458E -- AUGUST 2001 -- REVISED OCTOBER 2010

recommended operating conditions
MIN

MAX

UNIT

Input voltage, VDD

18

Output voltage range, VOUT

18

V

200

mA

--20

mA

105

°C

Average output current, IOUTW
Reference output current, IOUT(ref)W
Operating junction temperature, TJW


--40

V

It is not recommended that the device operate under conditions beyond those specified in this table for extended periods of time.

absolute maximum ratings over operating free-air temperature (unless otherwise noted)}w



Supply voltage (VDD) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 V
(MAX ICC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30 mA
Output current, IOUT peak . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±1 A
Output energy, capacitive load . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 μJ
Voltage rating (COMP, CS, FB) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . --0.3 V to 6.3 V
(OUT) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . --0.3 V to 20 V
(RT/CT) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . --0.3 V to 6.3 V
(VREF) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 V
Error amplifier output sink current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 mA
Total Power Dissipation at TA = 25°C: D package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50 °C/W
DGK package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 120°C/W
P package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 65°C/W
Operating junction temperature range, TJ . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . --55°C to 150°C
Storage temperature range Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . --65°C to 150°C
Lead Temperature (Soldering, 10 seconds) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 300°C

Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
§ All voltages are with respect to ground. Currents are positive into and negative out of the specified terminals. Consult the Packaging Section of the Databook for thermal limitations and considerations of the package.
AVAILABLE OPTIONS

100%

UCC28C42D

UCC28C42P

UCC28C42DGK

8.4V / 7.6V

UCC28C43D

UCC28C43P

UCC28C43DGK

UCC28C40D

UCC28C40P

UCC28C40DGK

UCC28C44D

UCC28C44P

UCC28C44DGK

8.4V / 7.6V

UCC28C45D

UCC28C45P

UCC28C45DGK

UCC28C41D

UCC28C41P

UCC28C41DGK

14.5V / 9.0V

50%

MSOP-8
SMALL OUTLINE
(DGK){

7.0V / 6.6V

--40°C to 105°C
40°C

PDIP-8
PLASTIC DIP
(P)

14.5V / 9.0V

100%

SOIC-8
SMALL OUTLINE
(D){

7.0V / 6.6V

MAXIMUM
DUTY CYCLE

UVLO
ON/OFF
14.5V / 9.0V

TA = TJ

UCC38C42D

UCC38C42P

UCC38C42DGK

8.4V / 7.6V

UCC38C43D

UCC38C43P

UCC38C43DGK

7.0V / 6.6V



2

UCC38C40P

UCC38C40DGK

UCC38C44D

UCC38C44P

UCC38C44DGK

8.4V / 7.6V

UCC38C45D

UCC38C45P

UCC38C45DGK

7.0V / 6.6V

50%

UCC38C40D

14.5V / 9.0V

0 C 70 C
0°C to 70°C

UCC38C41D

UCC38C41P

UCC38C41DGK

D (SOIC--8) and DGK (MSOP--8) packages are available taped and reeled. Add R suffix to device type (e.g.
UCC28C42DR) to order quantities of 2500 devices per reel. Tube quantities are 75 for D packages (SOIC--8) and
80 for DGK package (MSOP--8), and 50 for P package (PDIP-8).

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UCC28C40, UCC28C41, UCC28C42, UCC28C43, UCC28C44, UCC28C45
UCC38C40, UCC38C41, UCC38C42, UCC38C43, UCC38C44, UCC38C45
SLUS458E -- AUGUST 2001 -- REVISED OCTOBER 2010

electrical characteristics VDD = 15 V (See Note 1), RT = 10 kΩ, CT = 3.3 nF, CVDD = 0.1μF and no load on the outputs, TA = -40°C to 105°C for the UCC28C4x and TA = 0°C to 70°C for the UCC38C4x,
TA = TJ (unless otherwise noted)
PARAMETER

TEST CONDITIONS

MIN

TYP

MAX

UNITS

Reference Section
Output voltage, initial accuracy

TA = 25°C

IOUT = 1mA

4.9

Line regulation

VDD = 12 V to 18 V

Load regulation

1mA to 20mA

Temperature stability

See Note 2

Total output variation

See Note 2

Output noise voltage

10 Hz to 10 kHz,

TA = 25°C,

See Note 2

Long term stability

1000 hours,

TA = 125°C,

5.0

See Note 2

5.1

V

0.2

20

mV

3

25

mV

0.4

mV/°C

0.2
4.82

Output short circuit

5.18
50

V μV 5

25

mV

–45

–30

–55

mA kHz Oscillator Section
Initial accuracy

TA = 25°C,

Voltage stability

VDD = 12 V to 18 V

See Note 3

Temperature stability

TMIN to TMAX,

Amplitude

50.5

53

55

0.2%

1.0%

RT/CT Pin peak-to-peak

1%

2.5%

See Note 2

1.9

RT/CT = 2 V,

RT/CT = 2 V,

See Note 4

Feedback input voltage, initial accuracy

VCOMP = 2.5 V,

TA = 25°C

Feedback input voltage, total variation

VCOMP = 2.5 V,

Input bias current

VFB = 5.0 V

Open-loop voltage gain (AVOL)

VOUT = 2 V to 4 V

65

90

dB

Unity gain bandwidth

See Note 2

1.0

1.5

MHz

Power supply rejection ratio (PSRR)

VDD = 12 V to 18 V

60

Output sink current

VFB = 2.7 V,

VCOMP = 1.1 V

Output source current

VFB = 2.3 V,

VCOMP = 5V

High-level output voltage (VOH)

VFB = 2.7 V,

RLOAD = 15 k to GND

Low-level output voltage (VOL)

VFB = 2.7 V,

RLOAD = 15 k to VREF

Discharge current

See Note 4

V

TA = 25°C,

7.7

8.4

9.0

mA

7.2

8.4

9.5

mA

2.475

2.500

2.525

2.45

2.50

2.55

V

–0.1

–2.0

μA

Error Amplifier Section
V

dB

2

14

mA

–0.5

–1.0

mA

5

6.8

V

0.1

1.1

V

2.85

3.00

3.15

V/V

0.9

1.0

1.1

V

–0.1

–2.0

μA

35

70

ns

Current Sense Section
Gain

See Note 5, 6

Maximum input signal

VFB < 2.4 V

Power supply rejection ratio (PSRR)

VDD = 12 V to 18 V, See Note 2, 5

Input bias current
CS to output delay
COMP to CS offset
NOTE:
NOTE:
NOTE:
NOTE:
NOTE:

VCS = 0 V

70

1.15

dB

V

1.
2.
3.
4.
5.

Adjust VDD above the start threshold before setting at 15 V.
Ensured by design. Not production tested.
Output frequencies of the UCC38C41, UCC38C44 and the UCC38C45 are half the oscillator frequency.
Oscillator discharge current is measured with RT = 10 kΩ to VREF.
Parameter measured at trip point of latch with VFB = 0 V.
ΔV
COM , 0V ≼ V
≼ 900mV
NOTE: 6. Gain is defined as ACS =
CS
ΔV
CS

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3

UCC28C40, UCC28C41, UCC28C42, UCC28C43, UCC28C44, UCC28C45
UCC38C40, UCC38C41, UCC38C42, UCC38C43, UCC38C44, UCC38C45
SLUS458E -- AUGUST 2001 -- REVISED OCTOBER 2010

electrical characteristics VDD = 15 V (See Note 1), RT = 10 kΩ, CT = 3.3 nF, CVDD = 0.1μF and no load on the outputs, TA = -40°C to 105°C for the UCC28C4x and TA = 0°C to 70°C for the UCC38C4x,
TA = TJ (unless otherwise noted)
PARAMETER

TEST CONDITIONS

MIN

TYP

MAX

UNITS

Output Section
VOUT low (RDS(on) pull-down)

ISINK = 200 mA

5.5

15

VOUThigh (RDS(on) pull-up)

ISOURCE = 200 mA

10

25

Rise tIme

TA = 25°C,

CLOAD = 1 nF

25

50

Fall time

TA = 25°C,

CLOAD = 1 nF

20

40

Ω ns Undervoltage Lockout Section
UCC38C42, UCC38C44

15.5

7.8

8.4

9.0

UCC38C40, UCC38C41

6.5

7.0

7.5

UCC38C42, UCC38C44

8

9

10

UCC38C43, UCC38C45

7.0

7.6

8.2

UCC38C40, UCC38C41

6.1

6.6

7.1

UCC38C42, UCC38C43, UCC38C40, VFB < 2.4 V

94%

96%

UCC38C44, UCC38C45, UCC38C41, VFB < 2.4 V

Minimum operating voltage

14.5

UCC38C43, UCC38C45

Start threshold

13.5

47%

48%

V

PWM Section
Maximum duty cycle
Minimum duty cycle

VFB > 2.6 V

0%

Current Supply Section
Start-up current (ISTART-UP)

VDD = Undervoltage lockout start threshold (--0.5 V)

50

100

μA

Operating supply current (IDD)

VFB = VCS = 0 V

2.3

3.0

mA

NOTE 1:

Adjust VDD above the start threshold before setting at 15 V.
PDIP (P) or SOIC (D) PACKAGE
(TOP VIEW)

COMP
FB
CS
RT/CT

4

1

8

2

7

3
4

6
5

MSOP (DGK) PACKAGE
(TOP VIEW)

COMP
FB
CS
RT/CT

VREF
VDD
OUT
GND

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1

8

2

7

3

6

4

5

VREF
VDD
OUT
GND

UCC28C40, UCC28C41, UCC28C42, UCC28C43, UCC28C44, UCC28C45
UCC38C40, UCC38C41, UCC38C42, UCC38C43, UCC38C44, UCC38C45
SLUS458E -- AUGUST 2001 -- REVISED OCTOBER 2010

pin assignments
COMP: This pin provides the output of the error amplifier for compensation. In addition, the COMP pin is frequently used as a control port by utilizing a secondary-side error amplifier to send an error signal across the secondary-primary isolation boundary through an opto-isolator.
CS: The current sense pin is the non-inverting input to the PWM comparator. This is compared to a signal proportional to the error amplifier output voltage. A voltage ramp can be applied to this pin to run the device with a voltage mode control configuration.
FB: This pin is the inverting input to the error amplifier. The non-inverting input to the error amplifier is internally trimmed to 2.5 V ±1%.
GND: Ground return pin for the output driver stage and the logic level controller section.
OUT: The output of the on-chip drive stage. OUT is intended to directly drive a MOSFET. The OUT pin in the
UCC38C40, UCC38C42 and UCC38C43 is the same frequency as the oscillator, and can operate near 100% duty cycle. In the UCC38C41, UCC38C44 and the UCC38C45, the frequency of OUT is one-half that of the oscillator due to an internal T flipflop. This limits the maximum duty cycle to < 50%.
RT/CT: Timing resistor and timing capacitor. The timing capacitor should be connected to the device ground using minimal trace length.
VDD: Power supply pin for the device. This pin should be bypassed with a 0.1-μF capacitor with minimal trace lengths. Additional capacitance may be needed to provide hold up power to the device during startup.
VREF: 5-V reference. For stability, the reference should be bypassed with a 0.1-μF capacitor to ground using the minimal trace length possible.

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5

UCC28C40, UCC28C41, UCC28C42, UCC28C43, UCC28C44, UCC28C45
UCC38C40, UCC38C41, UCC38C42, UCC38C43, UCC38C44, UCC38C45
SLUS458E -- AUGUST 2001 -- REVISED OCTOBER 2010

APPLICATION INFORMATION
This device is a pin-for-pin replacement of the bipolar UC3842 family of controllers, the industry standard PWM controller for single-ended converters. Familiarity with this controller family is assumed.
The UCC28C4x/UCC38C4x series is an enhanced replacement with pin-to-pin compatibility to the bipolar
UC284x/UC384x and UC284xA/UC384xA families. The new series offers improved performance when compared to older bipolar devices and other competitive BiCMOS devices with similar functionality. Note that these improvements discussed below generally consist of tighter specification limits that are a subset of the older product ratings, maintaining drop-in capability. In new designs these improvements can be utilized to reduce the component count or enhance circuit performance when compared to the previously available devices. advantages
This device increases the total circuit efficiency whether operating off-line or in dc input circuits. In off-line applications the low start-up current of this device reduces steady state power dissipation in the startup resistor, and the low operating current maximizes efficiency while running. The low running current also provides an efficiency boost in battery operated supplies. low voltage operation
Two members of the UCC38C4x family are intended for applications that require a lower start-up voltage than the original family members. The UCC38C40 and UCC38C41 have a turn-on voltage of 7.0 V typical and exhibit hysteresis of 0.4 V for a turn-off voltage of 6.6 V. This reduced start-up voltage enables use in systems with lower voltages, such as 12-V battery systems which are nearly discharged. high speed operation
The BiCMOS design allows operation at high frequencies that were not feasible in the predecessor bipolar devices. First, the output stage has been redesigned to drive the external power switch in approximately half the time of the earlier devices. Second, the internal oscillator is more robust with less variation as frequency increases. In addition, the current sense to output delay has been reduced by a factor of three, to 45ns typical.
These features combine to provide a device capable of reliable high frequency operation.
The UCC38C4x family oscillator is true to the curves of the original bipolar devices at lower frequencies yet extends the frequency programmability range to at least 1MHz. This allows the device to offer pin to pin capability where required yet capable of extending the operational range to the higher frequencies typical of latest applications. When the original UC3842 was released in 1984 most switching supplies operated between
20kHz and 100kHz. Today, the UCC38C4x can be used in designs cover a span roughly ten times higher than those numbers. start/run current improvements
The start--up current is only 60 μA typical, a significant reduction from the bipolar device’s ratings of 300uA
(UC384xA). For operation over the temperature range of --40 to 85°C the UCC28C4x devices offer a maximum startup current of 100 μA, an improvement over competitive BiCMOS devices. This allows the power supply designer to further optimize the selection of the startup resistor value to provide a more efficient design. In applications where low component cost overrides maximum efficiency the low run current of 2.3 mA, typical, may allow the control device to run directly through the single resistor to (+) rail, rather than needing a bootstrap winding on the power transformer, along with a rectifier. The start/run resistor for this case must also pass enough current to allow driving the primary switching MOSFET, which may be a few milliamps in small devices.

6

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UCC28C40, UCC28C41, UCC28C42, UCC28C43, UCC28C44, UCC28C45
UCC38C40, UCC38C41, UCC38C42, UCC38C43, UCC38C44, UCC38C45
SLUS458E -- AUGUST 2001 -- REVISED OCTOBER 2010

APPLICATION INFORMATION
± 1% initial reference voltage
The BiCMOS internal reference of 2.5 V has an enhanced design and utilizes production trim to allow initial accuracy of ±1% at room temperature and ± 2% over the full temperature range. This can be used to eliminate an external reference in applications that do not require the extreme accuracy afforded by the additional device.
This is very useful for nonisolated dc-to-dc applications where the control device is referenced to the same common as the output. It is also applicable in offline designs that regulate on the primary side of the isolation boundary by looking at a primary bias winding, or perhaps from a winding on the output inductor of a buck-derived circuit. reduced discharge current variation
The original UC3842 oscillator did not have trimmed discharged current, and the parameter was not specified on the datasheet. Since many customers attempted to use the discharge current to set a crude deadtime limit the UC3842A family was released with a trimmed discharge current specified at 25°C. The
UCC28C4x/UCC38C4x series now offers even tighter control of this parameter, with approximately ±3% accuracy at 25°C, and less than 10% variation over temperature using the UCC28C4x devices. This level of accuracy can enable a meaningful limit to be programmed, a feature not currently seen in competitive BiCMOS devices. The improved oscillator and reference also contribute to decreased variation in the peak to peak variation in the oscillator waveform, which is often used as the basis for slope compensation for the complete power system. soft-start The following diagram provides a typical soft-start circuit for use with the UCC38C42. The values of R and C should be selected to bring the COMP pin up at a controlled rate, limiting the peak current supplied by the power stage. After the soft-start interval is complete the capacitor continues to charge to VREF, effectively removing the PNP transistor from circuit considerations.
The optional diode in parallel with the resistor forces a soft-start each time the PWM goes through UVLO and the reference (VREF) goes low. Without the diode,the capacitor otherwise remains charged during a brief loss of supply or brown-out, and no soft-start is enabled upon reapplication of VIN.

VREF
UCC38C42

8

COMP

1

GND
5

Figure 1

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UDG--01072

7

UCC28C40, UCC28C41, UCC28C42, UCC28C43, UCC28C44, UCC28C45
UCC38C40, UCC38C41, UCC38C42, UCC38C43, UCC38C44, UCC38C45
SLUS458E -- AUGUST 2001 -- REVISED OCTOBER 2010

APPLICATION INFORMATION oscillator synchronization
The UCC38C4x oscillator has the same synchronization characteristics as the original bipolar devices. Thus, the information in the Application Note U--100A, UC3842/3/4/5 Provides Low-Cost Current-Mode Control, (TI
Literature No. SLUA143) still applies. The application note describes how a small resistor from the timing capacitor-to-ground can offer an insertion point for synchronization to an external clock, (see Figures 2 and 3).
Figure 2 shows how the UCC38C42 can be synchronized to an external clock source. This allows precise control of frequency and dead time with a digital pulse train.
8

VREF

4

RT / CT

RT

SYNCHRONIZATION
CIRCUIT INPUT
CT

24 Ω

UCC38C42
PWM

UDG--01069

Figure 2. Oscillator Synchronization Circuit

CLOCK
INPUT

PWM
OUT

UPPER THRESHOLD
LOW

HIGH

LOW
LOWER THRESHOLD

ON .

OFF .

ON .

VCT (ANALOG)

OUTPUT A

UPPER THRESHOLD
VCT
LOWER THRESHOLD

VSYNC (DIGITAL)

COMBINED

Figure 3. Synchronization to an External Clock

8

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UDG--01070

UCC28C40, UCC28C41, UCC28C42, UCC28C43, UCC28C44, UCC28C45
UCC38C40, UCC38C41, UCC38C42, UCC38C43, UCC38C44, UCC38C45
SLUS458E -- AUGUST 2001 -- REVISED OCTOBER 2010

APPLICATION INFORMATION precautions The absolute maximum supply voltage is 20 V, including any transients that may be present. If this voltage is exceeded, device damage is likely. This is in contrast to the predecessor bipolar devices, which could survive up to 30 V. Thus, the supply pin should be decoupled as close to the ground pin as possible. Also, since no clamp is included in the device, the supply pin should be protected from external sources which could exceed the 20 V level. Careful layout of the printed board has always been a necessity for high frequency power supplies. As the device switching speeds and operating frequencies increase the layout of the converter becomes increasingly important. This 8-pin device has only a single ground for the logic and power connections. This forces the gate drive current pulses to flow through the same ground that the control circuit uses for reference. Thus, the interconnect inductance should be minimized as much as possible. One implication is to place the device (gate driver) circuitry close to the MOSFET it is driving. Note that this can conflict with the need for the error amplifier and the feedback path to be away from the noise generating components. circuit applications
Figure 4 shows a typical off-line application.
D50

F1

12 V
OUT

T1
AC INPUT
100 Vac -- 240 Vac
EMI FILTER
REQUIRED

+

R10

C12

BR1

D2

R11
C1A

C52

C3
D51

C18

C55

R56

L50

5V
OUT

R12

RT1

C53

D6

C54
R55

C5

SEC
COMMON
R6
IC2

R50

UCC38C44
1

COMP

REF 8

2

FB

R16

VCC 7

3

CS
RT/CT

IC2
C50

C13

OUT 6

4

Q1

GND 5

R50

R53

R52
C51

K
IC3
A

R

R54
UDG--01071

Figure 4. Typical Off-Line Application
Figure 5 shows the forward converter with synchronous rectification. This application provides 48 V to 3.3 V at
10 A with over 85% efficiency and uses the UCC38C42 as the secondary-side controller and UCC3961 as the primary-side startup control device.

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9

10

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46.4k

0.1uF

C5
7

6

5

4

3

2

AGnd

Ref

Rt

FB

SS

SD

OVS

R12
200

ucc3961

U1

R2

2

1

C7

8

9

10

11

12

13

14

T2

100pF

Vs

CS

PGnd

Out

Vdd

St

UVS

2.4k

R3

1.2k

4

3

R4
1.5k

300

R13

C8
1uF

Q2

470pF

C6

76.8k

R5

R6
4.7

C25
0.047uF

C10
2.7nF

0.1uF

C9

R8

R10
1k

5.1k

D1

R14

50k

R15

20k 40%

0.33

R9

Q1

C22
4.7nF

20k

R24

20k

402

R23

Q3

R25
20k

680pF

100

R28

R19
20

4.7

R26

C17
4700pF

3300pF

C12

5.6nF

C16

21.5k
C23

R17

R16

BAR74

D3

BAR74

D5

R20
10

1500pF

C11

4

3

2

1

4

3

2

1

Vcc

DT

Rt/Ct

CS

FB

U2

LODR

BTLO

HIDR

7.5k

R18

UCC38C4x

PGND

5

6

7

8

C19
470uF

4700pF

U4
TPS2832
IN
BOOT

COMP

R27
4.7

10

R21

Q4

GND

OUT

Vcc

REF

5

6

7

8

2uF

C26

470uF

C20

0.22uF

C13

+

R11

0.22uF

10nF

1

+

C4

C3

470uF

C1

R1
32.4k

10k

D2

T1

C18
+

VinN

VinP

R7

1nF

C2

L1
4.7uH

C14
1uF

C24
0.1uF

D6

BZX84C15LT1

PWRGND

0.1uF

C21

3r3V

100

R22

C15
1uF

UCC28C40, UCC28C41, UCC28C42, UCC28C43, UCC28C44, UCC28C45
UCC38C40, UCC38C41, UCC38C42, UCC38C43, UCC38C44, UCC38C45

SLUS458E -- AUGUST 2001 -- REVISED OCTOBER 2010

APPLICATION INFORMATION
+

Figure 5. Forward Converter with Synchronous Rectification Using the UCC38C42 as the Secondary-Side Controller

UCC28C40, UCC28C41, UCC28C42, UCC28C43, UCC28C44, UCC28C45
UCC38C40, UCC38C41, UCC38C42, UCC38C43, UCC38C44, UCC38C45
SLUS458E -- AUGUST 2001 -- REVISED OCTOBER 2010

TYPICAL CHARACTERISTICS
OSCILLATOR FREQUENCY vs TIMING RESISTANCE AND CAPACITANCE

OSCILLATOR DISCHARGE CURRENT vs TEMPERATURE
9.5

10 M

CT = 470 pF

1M

f - Frequency - Hz
-

IDISCH - Oscillator Discharge Current - mA
-

CT = 220 pF

CT = 1 nF
100 k

10 k
CT = 4.7 nF
CT = 2.2 nF
1k

1k

10 k

9.0

8.5

8.0

7.5

7.0

100 k

-50

-25

0

50

75

100

125

TJ - Temperature - °C
-

RT - Timing Resistance - Ω

Figure 6

Figure 7
COMP to CS OFFSET VOLTAGE (with CS = 0) vs TEMPERATURE

ERROR AMPLIFIER
FREQUENCY RESPONSE
200

1.8

90

180

1.6

160

1.4

GAIN

70

140

60

120

50

100

40

80

30

60

PHASE
MARGIN

1.0
0.8
0.6

40

10
1

10

100

1k

10 k

100 k

1M

0.4

20

20

0

1.2
COMP to CS

80

Phase Margin - (°)
-

100

Gain - (dB)
-

25

0.2

0
10 M

f - Frequency - Hz
-

0.0

-50

-25

0

25

50

75

100

125

TJ - Temperature - °C
-

Figure 8

Figure 9

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11

UCC28C40, UCC28C41, UCC28C42, UCC28C43, UCC28C44, UCC28C45
UCC38C40, UCC38C41, UCC38C42, UCC38C43, UCC38C44, UCC38C45
SLUS458E -- AUGUST 2001 -- REVISED OCTOBER 2010

TYPICAL CHARACTERISTICS
REFERENCE VOLTAGE vs TEMPERATURE

ERROR AMPLIFIER REFERENCE VOLTAGE vs TEMPERATURE
2.55
VEAREF - Error Amplifier Reference Voltage - V
-

5.05

VREF - Reference Voltage - V
-

5.04
5.03
5.02
5.01
5.00
4.99
4.98
4.97
4.96
4.95
-50

-25

0

25

50

75

100

2.54
2.53
2.52
2.51
2.50
2.49
2.48
2.47
2.46
2.45

125

-50

-25

TJ - Temperature - °C
-

0

REFERENCE SHORT-CIRCUIT CURRENT vs TEMPERATURE

100

125

200

-37

IBIAS - Error Amplifier Input Bias Current - nA
-

ISC - Reference Short Circuit Current - mA
-

75

ERROR AMPLIFIER INPUT BIAS CURRENT vs TEMPERATURE

-35

-39
-41
-43
-45
-47
-49
-51
-53
-25

0
25
50
75
TJ - Temperature - °C
-

100

125

150
100
50
0
-50
-100
-150
-200

-50

-25

0

25
50
75
TJ - Temperature - °C
-

Figure 13

Figure 12

12

50

Figure 11

Figure 10

-55
-50

25

TJ - Temperature - °C
-

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100

125

UCC28C40, UCC28C41, UCC28C42, UCC28C43, UCC28C44, UCC28C45
UCC38C40, UCC38C41, UCC38C42, UCC38C43, UCC38C44, UCC38C45
SLUS458E -- AUGUST 2001 -- REVISED OCTOBER 2010

TYPICAL CHARACTERISTICS

16

UNDERVOLTAGE LOCKOUT vs TEMPERATURE (UCC38C43 & UCC38C45)

UNDERVOLTAGE LOCKOUT vs TEMPERATURE (UCC38C42 & UCC38C44)
9.0

15

13

VUVLO - UVLO Voltage - V
-

14
UVLO
ON

12
UVLO
OFF

11
10
9

8.6
8.4
8.2
8.0
7.8
7.6

8

7.4

7

7.2

6

-50

-25

0

25

50

75

100

125

UVLO
OFF

7.0
-50

-25

0

TJ - Temperature - °C
-

Figure 14

25
50
75
TJ - Temperature - °C
-

100

125

Figure 15

UNDERVOLTAGE LOCKOUT vs TEMPERATURE (UCC38C40 & UCC38C41)
7.3
7.2

UVLO
ON

7.1
VUVLO - UVLO Voltage - V
-

VUVLO - UVLO Voltage - V
-

UVLO
ON

8.8

7.0
6.9
6.8
6.7
6.6
6.5
UVLO
OFF

6.4
6.3
-50

-25

0

25

50

75

100

125

TJ - Temperature - °C
Figure 16

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13

UCC28C40, UCC28C41, UCC28C42, UCC28C43, UCC28C44, UCC28C45
UCC38C40, UCC38C41, UCC38C42, UCC38C43, UCC38C44, UCC38C45
SLUS458E -- AUGUST 2001 -- REVISED OCTOBER 2010

TYPICAL CHARACTERISTICS
SUPPLY CURRENT vs TEMPERATURE

SUPPLY CURRENT vs OSCILLATOR FREQUENCY

3.0

25

1-nF LOAD

20

2.8
IDD - Supply Current - mA
-

IDD - Supply Current - mA
-

2.9

15

10
NO LOAD

2.7
2.6
2.5
2.4

NO LOAD

2.3
2.2

5

2.1
0

2.0
200 k

0k

400 k
600 k f - Frequency - Hz
-

800 k

1M

-50

-25

0

Figure 17

40

OUTPUT RISE TIME AND FALL TIME vs TEMPERATURE

75

100

125

MAXIMUM DUTY CYCLE vs OSCILLATOR FREQUENCY
100

10% to 90%
VDD = 12 V

CT = 220 pF

tr
(1 nF)

90

30 tf (1 nF)

25

20

10

80

70

CT = 1 nF

60

15

-50

-25

0

25

50

75

100

125

TJ - Temperature - °C

50

0

500

1000

1500

f - Frequency - kHz
-

Figure 19

14

50

Figure 18

Duty Cycle - %
-

Output Rise and Fall TIme - ns
-

35

25

TJ - Temperature - °C
-

Figure 20

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2000

2500

UCC28C40, UCC28C41, UCC28C42, UCC28C43, UCC28C44, UCC28C45
UCC38C40, UCC38C41, UCC38C42, UCC38C43, UCC38C44, UCC38C45
SLUS458E -- AUGUST 2001 -- REVISED OCTOBER 2010

TYPICAL CHARACTERISTICS
MAXIMUM DUTY CYCLE vs TEMPERATURE

100

MAXIMUM DUTY CYCLE vs TEMPERATURE
50

Output Rise and Fall TIme - ns
-

UCC38C40
UCC38C42
UCC38C43
Maximum Duty Cycle - %
-

98

96

94

92

UCC38C41
UCC38C44
UCC38C45

49

48

47

46

90
-50

-25

0

25

50

75

100

45

125

-50

-25

TJ - Temperature - °C
-

50

75

100

125

Figure 22

CURRENT SENSE THRESHOLD VOLTAGE vs TEMPERATURE

CS TO OUT DELAY TIME vs TEMPERATURE

70
65

1.05

tD - CD to OUT Delay Time - ns
-

VCS_th - Current Sense Threshold - V
-

25

TJ - Temperature - °C

Figure 21

1.10

0

1.00

0.95

60
55
50
45
40
35

0.90

-50

-25

0

25

50

75

100

125

TJ - Temperature - °C

30

-50

-25

0

25

50

75

100

125

TJ - Temperature - °C
-

Figure 23

Figure 24

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15

UCC28C40, UCC28C41, UCC28C42, UCC28C43, UCC28C44, UCC28C45
UCC38C40, UCC38C41, UCC38C42, UCC38C43, UCC38C44, UCC38C45
SLUS458E -- AUGUST 2001 -- REVISED OCTOBER 2010

Revision History
Revision SLUS458D to SLUS458E, 10/2010
1) Updated Operating Juction Temperature in the Recommended Operating Conditions Table, from

--55 to 150 to --40 to 105.

2) Updated Available Options Table heading from TA to TA = TJ.

16

www.ti.com

PACKAGE OPTION ADDENDUM

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20-Dec-2015

PACKAGING INFORMATION
Orderable Device

Status
(1)

Package Type Package Pins Package
Drawing
Qty

Eco Plan

Lead/Ball Finish

MSL Peak Temp

(2)

(6)

(3)

Op Temp (°C)

Device Marking
(4/5)

UCC28C40D

ACTIVE

SOIC

D

8

75

Green (RoHS
& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

-40 to 105

28C40

UCC28C40DG4

ACTIVE

SOIC

D

8

75

Green (RoHS
& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

-40 to 105

28C40

UCC28C40DGK

ACTIVE

VSSOP

DGK

8

80

Green (RoHS
& no Sb/Br)

CU NIPDAUAG

Level-2-260C-1 YEAR

-40 to 105

28C40

UCC28C40DGKR

ACTIVE

VSSOP

DGK

8

2500

Green (RoHS
& no Sb/Br)

CU NIPDAUAG

Level-2-260C-1 YEAR

-40 to 85

28C40

UCC28C40DGKRG4

ACTIVE

VSSOP

DGK

8

2500

Green (RoHS
& no Sb/Br)

CU NIPDAUAG

Level-2-260C-1 YEAR

-40 to 85

28C40

UCC28C40DR

ACTIVE

SOIC

D

8

2500

Green (RoHS
& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

-40 to 105

28C40

UCC28C40DRG4

ACTIVE

SOIC

D

8

2500

Green (RoHS
& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

-40 to 105

28C40

UCC28C40P

ACTIVE

PDIP

P

8

50

Green (RoHS
& no Sb/Br)

CU NIPDAU

N / A for Pkg Type

-40 to 105

UCC28C40P

UCC28C41D

ACTIVE

SOIC

D

8

75

Green (RoHS
& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

-40 to 105

28C41

UCC28C41DG4

ACTIVE

SOIC

D

8

75

Green (RoHS
& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

-40 to 105

28C41

UCC28C41DGK

ACTIVE

VSSOP

DGK

8

100

Green (RoHS
& no Sb/Br)

CU NIPDAUAG

Level-2-260C-1 YEAR

-40 to 105

28C41

UCC28C41DGKR

ACTIVE

VSSOP

DGK

8

2500

Green (RoHS
& no Sb/Br)

CU NIPDAUAG

Level-2-260C-1 YEAR

-40 to 105

28C41

UCC28C41DGKRG4

ACTIVE

VSSOP

DGK

8

TBD

Call TI

Call TI

-40 to 105

UCC28C41DR

ACTIVE

SOIC

D

8

2500

Green (RoHS
& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

-40 to 105

28C41

UCC28C41DRG4

ACTIVE

SOIC

D

8

2500

Green (RoHS
& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

-40 to 105

28C41

UCC28C42D

ACTIVE

SOIC

D

8

75

Green (RoHS
& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

-40 to 105

28C42

UCC28C42DG4

ACTIVE

SOIC

D

8

75

Green (RoHS
& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

-40 to 105

28C42

Addendum-Page 1

Samples

PACKAGE OPTION ADDENDUM

www.ti.com

20-Dec-2015

Orderable Device

Status
(1)

Package Type Package Pins Package
Drawing
Qty

Eco Plan

Lead/Ball Finish

MSL Peak Temp

(2)

(6)

(3)

Op Temp (°C)

Device Marking
(4/5)

UCC28C42DGK

ACTIVE

VSSOP

DGK

8

100

Green (RoHS
& no Sb/Br)

CU NIPDAUAG

Level-2-260C-1 YEAR

-40 to 105

28C42

UCC28C42DGKR

ACTIVE

VSSOP

DGK

8

2500

Green (RoHS
& no Sb/Br)

CU NIPDAUAG

Level-2-260C-1 YEAR

-40 to 105

28C42

UCC28C42DR

ACTIVE

SOIC

D

8

2500

Green (RoHS
& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

-40 to 105

28C42

UCC28C42DRG4

ACTIVE

SOIC

D

8

2500

Green (RoHS
& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

-40 to 105

28C42

UCC28C42P

ACTIVE

PDIP

P

8

50

Green (RoHS
& no Sb/Br)

CU NIPDAU

N / A for Pkg Type

-40 to 105

UCC28C42P

UCC28C43D

ACTIVE

SOIC

D

8

75

Green (RoHS
& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

-40 to 105

28C43

UCC28C43DG4

ACTIVE

SOIC

D

8

75

Green (RoHS
& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

-40 to 105

28C43

UCC28C43DGK

ACTIVE

VSSOP

DGK

8

80

Green (RoHS
& no Sb/Br)

CU NIPDAUAG

Level-2-260C-1 YEAR

-40 to 105

28C43

UCC28C43DGKR

ACTIVE

VSSOP

DGK

8

2500

Green (RoHS
& no Sb/Br)

CU NIPDAUAG

Level-2-260C-1 YEAR

-40 to 105

28C43

UCC28C43DGKRG4

ACTIVE

VSSOP

DGK

8

2500

Green (RoHS
& no Sb/Br)

CU NIPDAUAG

Level-2-260C-1 YEAR

-40 to 105

28C43

UCC28C43DR

ACTIVE

SOIC

D

8

2500

Green (RoHS
& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

-40 to 105

28C43

UCC28C43DRG4

ACTIVE

SOIC

D

8

2500

Green (RoHS
& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

-40 to 105

28C43

UCC28C43P

ACTIVE

PDIP

P

8

50

Green (RoHS
& no Sb/Br)

CU NIPDAU

N / A for Pkg Type

-40 to 105

UCC28C43P

UCC28C43PG4

ACTIVE

PDIP

P

8

50

Green (RoHS
& no Sb/Br)

CU NIPDAU

N / A for Pkg Type

-40 to 105

UCC28C43P

UCC28C44D

ACTIVE

SOIC

D

8

75

Green (RoHS
& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

-40 to 105

28C44

UCC28C44DG4

ACTIVE

SOIC

D

8

75

Green (RoHS
& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

-40 to 105

28C44

UCC28C44DGK

ACTIVE

VSSOP

DGK

8

80

Green (RoHS
& no Sb/Br)

CU NIPDAUAG

Level-2-260C-1 YEAR

-40 to 105

28C44

UCC28C44DGKG4

ACTIVE

VSSOP

DGK

8

80

Green (RoHS
& no Sb/Br)

CU NIPDAUAG

Level-2-260C-1 YEAR

-40 to 85

28C44

Addendum-Page 2

Samples

PACKAGE OPTION ADDENDUM

www.ti.com

20-Dec-2015

Orderable Device

Status
(1)

Package Type Package Pins Package
Drawing
Qty

Eco Plan

Lead/Ball Finish

MSL Peak Temp

(2)

(6)

(3)

Op Temp (°C)

Device Marking
(4/5)

UCC28C44DGKR

ACTIVE

VSSOP

DGK

8

2500

Green (RoHS
& no Sb/Br)

CU NIPDAUAG

Level-2-260C-1 YEAR

-40 to 105

28C44

UCC28C44DR

ACTIVE

SOIC

D

8

2500

Green (RoHS
& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

-40 to 105

28C44

UCC28C44DRG4

ACTIVE

SOIC

D

8

2500

Green (RoHS
& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

-40 to 105

28C44

UCC28C44P

ACTIVE

PDIP

P

8

50

Green (RoHS
& no Sb/Br)

CU NIPDAU

N / A for Pkg Type

-40 to 105

UCC28C44P

UCC28C44PG4

ACTIVE

PDIP

P

8

50

Green (RoHS
& no Sb/Br)

CU NIPDAU

N / A for Pkg Type

-40 to 105

UCC28C44P

UCC28C45D

ACTIVE

SOIC

D

8

75

Green (RoHS
& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

-40 to 105

28C45

UCC28C45DG4

ACTIVE

SOIC

D

8

TBD

Call TI

Call TI

-40 to 105

UCC28C45DGK

ACTIVE

VSSOP

DGK

8

100

Green (RoHS
& no Sb/Br)

CU NIPDAUAG

Level-2-260C-1 YEAR

-40 to 105

28C45

UCC28C45DGKR

ACTIVE

VSSOP

DGK

8

2500

Green (RoHS
& no Sb/Br)

CU NIPDAUAG

Level-2-260C-1 YEAR

-40 to 105

28C45

UCC28C45DGKRG4

ACTIVE

VSSOP

DGK

8

2500

Green (RoHS
& no Sb/Br)

CU NIPDAUAG

Level-2-260C-1 YEAR

-40 to 105

28C45

UCC28C45DR

ACTIVE

SOIC

D

8

2500

Green (RoHS
& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

-40 to 105

28C45

UCC28C45DRG4

ACTIVE

SOIC

D

8

2500

Green (RoHS
& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

-40 to 105

28C45

UCC28C45P

ACTIVE

PDIP

P

8

50

Green (RoHS
& no Sb/Br)

CU NIPDAU

N / A for Pkg Type

-40 to 105

UCC28C45P

UCC38C40D

ACTIVE

SOIC

D

8

75

Green (RoHS
& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

0 to 70

38C40

UCC38C40DGK

ACTIVE

VSSOP

DGK

8

80

Green (RoHS
& no Sb/Br)

CU NIPDAUAG

Level-2-260C-1 YEAR

0 to 70

38C40

UCC38C40DGKR

ACTIVE

VSSOP

DGK

8

2500

Green (RoHS
& no Sb/Br)

CU NIPDAUAG

Level-2-260C-1 YEAR

0 to 70

38C40

UCC38C40DR

ACTIVE

SOIC

D

8

2500

Green (RoHS
& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

0 to 70

38C40

UCC38C40DRG4

ACTIVE

SOIC

D

8

2500

Green (RoHS
& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

0 to 70

38C40

Addendum-Page 3

Samples

PACKAGE OPTION ADDENDUM

www.ti.com

20-Dec-2015

Orderable Device

Status
(1)

Package Type Package Pins Package
Drawing
Qty

Eco Plan

Lead/Ball Finish

MSL Peak Temp

(2)

(6)

(3)

Op Temp (°C)

Device Marking
(4/5)

UCC38C40P

ACTIVE

PDIP

P

8

50

Green (RoHS
& no Sb/Br)

CU NIPDAU

N / A for Pkg Type

0 to 70

UCC38C40P

UCC38C41D

ACTIVE

SOIC

D

8

75

Green (RoHS
& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

0 to 70

38C41

UCC38C41DGK

ACTIVE

VSSOP

DGK

8

100

Green (RoHS
& no Sb/Br)

CU NIPDAUAG

Level-2-260C-1 YEAR

0 to 70

38C41

UCC38C41DGKG4

ACTIVE

VSSOP

DGK

8

100

Green (RoHS
& no Sb/Br)

CU NIPDAUAG

Level-2-260C-1 YEAR

0 to 70

38C41

UCC38C41DR

ACTIVE

SOIC

D

8

2500

Green (RoHS
& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

0 to 70

38C41

UCC38C41DRG4

ACTIVE

SOIC

D

8

2500

Green (RoHS
& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

0 to 70

38C41

UCC38C41P

ACTIVE

PDIP

P

8

50

Green (RoHS
& no Sb/Br)

CU NIPDAU

N / A for Pkg Type

0 to 70

UCC38C41P

UCC38C42D

ACTIVE

SOIC

D

8

75

Green (RoHS
& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

0 to 70

38C42

UCC38C42DG4

ACTIVE

SOIC

D

8

75

Green (RoHS
& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

0 to 70

38C42

UCC38C42DGK

ACTIVE

VSSOP

DGK

8

100

Green (RoHS
& no Sb/Br)

CU NIPDAUAG

Level-2-260C-1 YEAR

0 to 70

38C42

UCC38C42DGKR

ACTIVE

VSSOP

DGK

8

2500

Green (RoHS
& no Sb/Br)

CU NIPDAUAG

Level-2-260C-1 YEAR

0 to 70

38C42

UCC38C42DR

ACTIVE

SOIC

D

8

2500

Green (RoHS
& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

0 to 70

38C42

UCC38C42DRG4

ACTIVE

SOIC

D

8

2500

Green (RoHS
& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

0 to 70

38C42

UCC38C42P

ACTIVE

PDIP

P

8

50

Green (RoHS
& no Sb/Br)

CU NIPDAU

N / A for Pkg Type

0 to 70

UCC38C42P

UCC38C42PG4

ACTIVE

PDIP

P

8

50

Green (RoHS
& no Sb/Br)

CU NIPDAU

N / A for Pkg Type

0 to 70

UCC38C42P

UCC38C43D

ACTIVE

SOIC

D

8

75

Green (RoHS
& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

0 to 70

38C43

UCC38C43DG4

ACTIVE

SOIC

D

8

75

Green (RoHS
& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

0 to 70

38C43

UCC38C43DGK

ACTIVE

VSSOP

DGK

8

80

Green (RoHS
& no Sb/Br)

CU NIPDAUAG

Level-2-260C-1 YEAR

0 to 70

38C43

Addendum-Page 4

Samples

PACKAGE OPTION ADDENDUM

www.ti.com

20-Dec-2015

Orderable Device

Status
(1)

Package Type Package Pins Package
Drawing
Qty

Eco Plan

Lead/Ball Finish

MSL Peak Temp

(2)

(6)

(3)

Op Temp (°C)

Device Marking
(4/5)

UCC38C43DGKG4

ACTIVE

VSSOP

DGK

8

80

Green (RoHS
& no Sb/Br)

CU NIPDAUAG

Level-2-260C-1 YEAR

0 to 70

38C43

UCC38C43DGKR

ACTIVE

VSSOP

DGK

8

2500

Green (RoHS
& no Sb/Br)

CU NIPDAUAG

Level-2-260C-1 YEAR

0 to 70

38C43

UCC38C43DGKRG4

ACTIVE

VSSOP

DGK

8

2500

Green (RoHS
& no Sb/Br)

CU NIPDAUAG

Level-2-260C-1 YEAR

0 to 70

38C43

UCC38C43DR

ACTIVE

SOIC

D

8

2500

Green (RoHS
& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

0 to 70

38C43

UCC38C43DRG4

ACTIVE

SOIC

D

8

2500

Green (RoHS
& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

0 to 70

38C43

UCC38C43P

ACTIVE

PDIP

P

8

50

Green (RoHS
& no Sb/Br)

CU NIPDAU

N / A for Pkg Type

0 to 70

UCC38C43P

UCC38C43PG4

ACTIVE

PDIP

P

8

50

Green (RoHS
& no Sb/Br)

CU NIPDAU

N / A for Pkg Type

0 to 70

UCC38C43P

UCC38C44D

ACTIVE

SOIC

D

8

75

Green (RoHS
& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

0 to 70

38C44

UCC38C44DG4

ACTIVE

SOIC

D

8

75

Green (RoHS
& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

0 to 70

38C44

UCC38C44DGK

ACTIVE

VSSOP

DGK

8

80

Green (RoHS
& no Sb/Br)

CU NIPDAUAG

Level-2-260C-1 YEAR

0 to 70

38C44

UCC38C44DGKR

ACTIVE

VSSOP

DGK

8

2500

Green (RoHS
& no Sb/Br)

CU NIPDAUAG

Level-2-260C-1 YEAR

0 to 70

38C44

UCC38C44DR

ACTIVE

SOIC

D

8

2500

Green (RoHS
& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

0 to 70

38C44

UCC38C44DRG4

ACTIVE

SOIC

D

8

2500

Green (RoHS
& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

0 to 70

38C44

UCC38C44P

ACTIVE

PDIP

P

8

50

Green (RoHS
& no Sb/Br)

CU NIPDAU

N / A for Pkg Type

0 to 70

UCC38C44P

UCC38C44PG4

ACTIVE

PDIP

P

8

50

Green (RoHS
& no Sb/Br)

CU NIPDAU

N / A for Pkg Type

0 to 70

UCC38C44P

UCC38C45D

ACTIVE

SOIC

D

8

75

Green (RoHS
& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

0 to 70

38C45

UCC38C45DG4

ACTIVE

SOIC

D

8

75

Green (RoHS
& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

0 to 70

38C45

UCC38C45DGK

ACTIVE

VSSOP

DGK

8

80

Green (RoHS
& no Sb/Br)

CU NIPDAUAG

Level-2-260C-1 YEAR

0 to 70

38C45

Addendum-Page 5

Samples

PACKAGE OPTION ADDENDUM

www.ti.com

20-Dec-2015

Orderable Device

Status
(1)

Package Type Package Pins Package
Drawing
Qty

Eco Plan

Lead/Ball Finish

MSL Peak Temp

(2)

(6)

(3)

Op Temp (°C)

Device Marking
(4/5)

UCC38C45DGKR

ACTIVE

VSSOP

DGK

8

2500

Green (RoHS
& no Sb/Br)

CU NIPDAUAG

Level-2-260C-1 YEAR

0 to 70

38C45

UCC38C45DR

ACTIVE

SOIC

D

8

2500

Green (RoHS
& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

0 to 70

38C45

UCC38C45DRG4

ACTIVE

SOIC

D

8

2500

Green (RoHS
& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

0 to 70

38C45

UCC38C45P

ACTIVE

PDIP

P

8

50

Green (RoHS
& no Sb/Br)

CU NIPDAU

N / A for Pkg Type

0 to 70

UCC38C45P

(1)

The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)

Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)

MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.

(4)

There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.

(5)

Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device.
(6)

Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and

Addendum-Page 6

Samples

PACKAGE OPTION ADDENDUM

www.ti.com

20-Dec-2015

continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF UCC28C41, UCC28C43, UCC28C45 :

• Automotive: UCC28C41-Q1
• Enhanced Product: UCC28C43-EP, UCC28C45-EP
NOTE: Qualified Version Definitions:

• Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects
• Enhanced Product - Supports Defense, Aerospace and Medical Applications

Addendum-Page 7

PACKAGE MATERIALS INFORMATION www.ti.com 22-Dec-2015

TAPE AND REEL INFORMATION

*All dimensions are nominal

Device

UCC28C40DGKR

Package Package Pins
Type Drawing
VSSOP

SPQ

Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)

B0
(mm)

K0
(mm)

P1
(mm)

W
Pin1
(mm) Quadrant

DGK

8

2500

330.0

12.4

5.3

3.4

1.4

8.0

12.0

Q1

UCC28C40DR

SOIC

D

8

2500

330.0

12.4

6.4

5.2

2.1

8.0

12.0

Q1

UCC28C41DGKR

VSSOP

DGK

8

2500

330.0

12.4

5.3

3.4

1.4

8.0

12.0

Q1

UCC28C41DR

SOIC

D

8

2500

330.0

12.4

6.4

5.2

2.1

8.0

12.0

Q1

UCC28C42DGKR

VSSOP

DGK

8

2500

330.0

12.4

5.3

3.4

1.4

8.0

12.0

Q1

UCC28C42DR

SOIC

D

8

2500

330.0

12.4

6.4

5.2

2.1

8.0

12.0

Q1

UCC28C43DGKR

VSSOP

DGK

8

2500

330.0

12.4

5.3

3.4

1.4

8.0

12.0

Q1

UCC28C43DR

SOIC

D

8

2500

330.0

12.4

6.4

5.2

2.1

8.0

12.0

Q1

UCC28C44DGKR

VSSOP

DGK

8

2500

330.0

12.4

5.3

3.4

1.4

8.0

12.0

Q1

UCC28C44DR

SOIC

D

8

2500

330.0

12.4

6.4

5.2

2.1

8.0

12.0

Q1

UCC28C45DGKR

VSSOP

DGK

8

2500

330.0

12.4

5.3

3.4

1.4

8.0

12.0

Q1

UCC28C45DR

SOIC

D

8

2500

330.0

12.4

6.4

5.2

2.1

8.0

12.0

Q1

UCC38C40DGKR

VSSOP

DGK

8

2500

330.0

12.4

5.3

3.4

1.4

8.0

12.0

Q1

UCC38C40DR

SOIC

D

8

2500

330.0

12.4

6.4

5.2

2.1

8.0

12.0

Q1

UCC38C41DR

SOIC

D

8

2500

330.0

12.4

6.4

5.2

2.1

8.0

12.0

Q1

UCC38C42DGKR

VSSOP

DGK

8

2500

330.0

12.4

5.3

3.4

1.4

8.0

12.0

Q1

UCC38C42DR

SOIC

D

8

2500

330.0

12.4

6.4

5.2

2.1

8.0

12.0

Q1

UCC38C43DGKR

VSSOP

DGK

8

2500

330.0

12.4

5.3

3.4

1.4

8.0

12.0

Q1

Pack Materials-Page 1

PACKAGE MATERIALS INFORMATION www.ti.com 22-Dec-2015

Device

Package Package Pins
Type Drawing

SPQ

Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)

B0
(mm)

K0
(mm)

P1
(mm)

W
Pin1
(mm) Quadrant

UCC38C43DR

SOIC

D

8

2500

330.0

12.4

6.4

5.2

2.1

8.0

12.0

Q1

UCC38C44DGKR

VSSOP

DGK

8

2500

330.0

12.4

5.3

3.4

1.4

8.0

12.0

Q1

UCC38C44DR

SOIC

D

8

2500

330.0

12.4

6.4

5.2

2.1

8.0

12.0

Q1

UCC38C45DGKR

VSSOP

DGK

8

2500

330.0

12.4

5.3

3.4

1.4

8.0

12.0

Q1

UCC38C45DR

SOIC

D

8

2500

330.0

12.4

6.4

5.2

2.1

8.0

12.0

Q1

*All dimensions are nominal

Device

Package Type

Package Drawing

Pins

SPQ

Length (mm)

Width (mm)

Height (mm)

UCC28C40DGKR

VSSOP

DGK

8

2500

366.0

364.0

50.0

UCC28C40DR

SOIC

D

8

2500

340.5

338.1

20.6

UCC28C41DGKR

VSSOP

DGK

8

2500

367.0

367.0

35.0

UCC28C41DR

SOIC

D

8

2500

340.5

338.1

20.6

UCC28C42DGKR

VSSOP

DGK

8

2500

367.0

367.0

35.0

UCC28C42DR

SOIC

D

8

2500

340.5

338.1

20.6

UCC28C43DGKR

VSSOP

DGK

8

2500

367.0

367.0

35.0

UCC28C43DR

SOIC

D

8

2500

340.5

338.1

20.6

UCC28C44DGKR

VSSOP

DGK

8

2500

366.0

364.0

50.0

UCC28C44DR

SOIC

D

8

2500

340.5

338.1

20.6

UCC28C45DGKR

VSSOP

DGK

8

2500

366.0

364.0

50.0

UCC28C45DR

SOIC

D

8

2500

340.5

338.1

20.6

Pack Materials-Page 2

PACKAGE MATERIALS INFORMATION www.ti.com 22-Dec-2015

Device

Package Type

Package Drawing

Pins

SPQ

Length (mm)

Width (mm)

Height (mm)

UCC38C40DGKR

VSSOP

DGK

8

2500

367.0

367.0

35.0

UCC38C40DR

SOIC

D

8

2500

340.5

338.1

20.6

UCC38C41DR

SOIC

D

8

2500

340.5

338.1

20.6

UCC38C42DGKR

VSSOP

DGK

8

2500

367.0

367.0

35.0

UCC38C42DR

SOIC

D

8

2500

340.5

338.1

20.6

UCC38C43DGKR

VSSOP

DGK

8

2500

367.0

367.0

35.0

UCC38C43DR

SOIC

D

8

2500

340.5

338.1

20.6

UCC38C44DGKR

VSSOP

DGK

8

2500

367.0

367.0

35.0

UCC38C44DR

SOIC

D

8

2500

340.5

338.1

20.6

UCC38C45DGKR

VSSOP

DGK

8

2500

367.0

367.0

35.0

UCC38C45DR

SOIC

D

8

2500

340.5

338.1

20.6

Pack Materials-Page 3

IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily performed. TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide adequate design and operating safeguards.
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Copyright © 2015, Texas Instruments Incorporated

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...examining room was also an important factor. Availability of some assistants and instructing them on the standing operating procedures based on the workload proved to be an add-on. Initial paper work took some time, so the new patients were asked to come earlier so that the work could be completed on time. Also informing the new patients to adhere to appointment timings was a usual practice to avoid delays. What procedures were followed to keep the appointment system flexible enough to accommodate the emergency cases, and yet be able to keep up with the other patients’ appointments? It is often observed that doctors misuse the time and often emergency cases are taken as excuses for not adhering to the schedule. It was important to make the system flexible to adjust the emergency cases as well as to adhere to the timelines and get back to schedule. In case of real emergencies like fractures or caesarean section etc., all other appointments could be dropped; however in case of small issues, the doctor was expected to come back on track as early as possible and give the patient a choice to wait or reschedule the appointment. Also the assistant of the doctors were ordered to keep some open slots throughout the day for the patients suffering acutely. This time was also used to look into the emergency...

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.../InstructorResourceManual.pdf‎ The case was prepared by Mark S. Beasley, Ph.D. and Frank A. Buckless, Ph.D. of North Carolina State University and .... Case 1.1: Ocean Manufacturing, Inc. Ocean Manufacutring Inc The New Client Acceptance ... www.studymode.com/.../ocean-manufacutring-inc-the-new-client-accept...‎ Ocean Manufacturing, Inc.: the New Client Acceptance Decision: Case 1.1 Ocean ... Problem Solution: Harrison-Keyes Inc. Ayodeji Ajayi University of Phoenix ... Ocean Manufacturing, Inc.: The New Client Acceptance ... www.freecasestudysolutions.com/case-study-Ocean-Manufacturing-Inc-...‎ Case 1.1 Ocean Manufacturing, Inc.: The New Client Acceptance Decision Ocean Manufacturing, Inc. is recommended as a ... ORDER NEW SOLUTIONS ... Solution Manual for Auditing Cases An Interactive Learning ... testbanksfor.com › All test banks and solution manuals‎ Download Solution Manual for Auditing Cases An Interactive Learning Approach 5th Edition by Beasely. Solution Of Ocean Manufacturing Inc Free Essays 1 - 30 www.papercamp.com/group/solution-of-ocean-manufacturing.../page-0‎ Free Essays on Solution Of Ocean Manufacturing Inc for students. ... ACCT 805AE Case 4 Ocean Manufacturing, Inc The Osprey Group Feb 21, ... Auditing: r c aSe S t h at diSc uSS topicS rel ated to thiS Section 1.1 Ocean Manufacturing, Inc. . Case 1 1 Ocean Manufacturing Inc Free Essays 1 - 30 www.papercamp.com/group/case-1-1-ocean-manufacturing-inc/page-0‎ Case 1.1 Ocean Manufacturing, Inc.: The...

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...Documentum |   |   | Setting for the Case In November 1993 Jeff Miller, Documentum's CEO, is faced with the challenge of pursuing either a vertical or horizontal marketing strategy to route Documentum towards profitability.   Situation and Business Issues Documentum enjoys a leading role in an emerging and potentially lucrative space. But profiting from this opportunity will require overcoming several immediate hurdles including a limited customer base, formidable competitors and unforeseen development costs.  Key Information, Facts, Assumptions Documentum was founded in June 1990 by Howard Shao and John Newton, seasoned database engineers who aimed to develop a new class of software for automating the management of documents across an enterprise. Following three years of losses, Documentum gains traction by combining an elite management team with $5.8MM of Venture Capitalist funding.    Analysis Enterprise document management (EDM) is a new, paradigm-busting product category with few substitutes. The category growth is small, increasing at a rate of 1%-2% year over year . Competition within the EDM category is low, as no other company was developing the "whole elephant" solution. Profitability was extremely low, given the low number of customers and long lead time to develop and deliver the product solution. The combination of these characteristics wholly describes the EDM category as being in the Introduction Stage of the Category Life Cycle .     With regards...

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...THE ON OT C OP YO CASE STUDY HANDBOOK RP OS T ON OP YO RP OT C OS T THE ON OT C Write Persuasively About Cases OP CASE STUDY HANDBOOK How to Read, Discuss, and William Ellet Harvard Business School Press Boston, Massachusetts YO RP OS T Copyright 2007 William Ellet All rights reserved Printed in the United States of America 11 10 09 08 07 5 4 3 2 1 No part of this publication may be reproduced, stored in or introduced into a retrieval system, or transmitted, in any form, or by any means (electronic, mechanical, photocopying, recording, or otherwise), without the prior permission of the publisher. Requests for permission should be directed to permissions@hbsp.harvard.edu, or mailed to Permissions, Harvard Business School Publishing, 60 Harvard Way, Boston, Massachusetts 02163. The copyright on each case in this book unless otherwise noted is held by the President and Fellows of Harvard College and they are published herein by express permission. Permission requests to use individual Harvard copyrighted cases should be directed to permissions@hbsp.harvard.edu, or mailed to the Permissions Editor, Harvard Business School Publishing, 60 Harvard Way, Boston, MA 02163. ON OT C Case material of the Harvard Graduate School of Business Administration is made possible by the cooperation of business firms and other organizations which may wish to remain anonymous by having names, quantities, and other...

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...Ralph’s Grocery and United Food and Commercial Workers Union The case that I chose for the week 6 critical thinking assignment concerns Ralph’s Grocery Company, located in California. It applies to this week’s material due to the fact that the case involves unlawful suspension and discharge of an employee, as reviewed by the National Labor Relations Board. Background In May 2011, Vittorio Razi was an employee at Ralph’s Grocery and was suspended and terminated after he refused to take a drug test without first consulting with his UFCW Local 324 representative. The company (Respondent) says that on the day in question, Razi’s behavior was in question, acting nervous, anxious, agitated, and slurred speech. After a couple managers discussed the...

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...A Case for Case Studies Margo A. Ihde Liberty University Author Note Correspondence concerning this article should be addressed to Margo A. Ihde, Psychology 255-B05, Liberty University, Lynchburg, Va. 24515. E-mail: mihde@liberty.edu A Case for Case Studies Case Studies are utilized across many disciplines including but not limited to medical science, political science, social science and psychology. There is however some confusion as it relates to the use of case studies. The first such confusion that must be clarified is what the definition of a case study is and what constitutes a case study. The second clarification is to identify the reasons for using a case study. A third area is outlining the advantages and disadvantages of using a case study. Lastly, when a researcher concludes a case study would be the best option they then must determine where and in what ways would the data and information be sourced. Identifying the answers for these four areas is imperative to understanding and utilizing a case study. Case Study – Defined The definition for a case study within all many disciplines is very similar. A case study is usually described as an investigation into a real situation involving an individual, a group, an organization, or a society focusing on a single subject or object (Pegram, 2000). To begin, identifying a case studies purpose would contribute to determining what would and should be investigated. The study could focus on the “history...

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...Join now! Login Support Other Term Papers and Free Essays Browse Papers Business / Timbuk2 Case Study Timbuk2 Case Study Term Papers Timbuk2 Case Study and over other 20 000+ free term papers, essays and research papers examples are available on the website! Autor: santhanam.vikram 09 December 2013 Tags: Words: 723 | Pages: 3 Views: 86 Read Full Essay Join Now! CASE STUDY: TIMBUK2 1.) Consider the two categories of products that Timbuk2 makes and sells. For the custom messenger bag, what are the key competitive dimensions that are driving sales? Are their competitive priorities different for the new laptop bags sourced in China? Some of the competitive advantage which are the key factors of Timbuk2 bags are:-  Quality  Durable  Reliable  Not prone to defects  Custom made bags for each of the customers  The quick delivery of bags  The rave review which the company gets for its bags i.e. it basically carries a good name in the market  For its laptop bags, even though they are manufactured in china, the designing is done in San Francisco. so the exclusivity remains  Cost effective manufacture of laptop bags in china  Being able to adopt to changes in demand and fashion By manufacturing the bags in china the company saved the manufacturing cost but lost their niche of manufacturing and selling in America itself. The general perception of it being a Chinese product led to customers felling little...

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