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Nor Gate Datasheet

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Data sheet acquired from Harris Semiconductor SCHS016C – Revised September 2003

The CD4001UB types are supplied in 14-lead hermetic dual-in-line ceramic packages (F3A suffix), 14-lead dual-in-line plastic packages (E suffix), 14-lead small-outline packages (M, MT, M96, and NSR suffixes), and 14-lead thin shrink small-outline packages (PW and PWR suffixes).

Copyright © 2003, Texas Instruments Incorporated

PACKAGE OPTION ADDENDUM www.ti.com 11-Nov-2009

PACKAGING INFORMATION
Orderable Device CD4001UBE CD4001UBEE4 CD4001UBF CD4001UBF3A CD4001UBM CD4001UBM96 CD4001UBM96E4 CD4001UBM96G4 CD4001UBME4 CD4001UBMG4 CD4001UBMT CD4001UBMTE4 CD4001UBMTG4 CD4001UBPW CD4001UBPWE4 CD4001UBPWR CD4001UBPWRE4 CD4001UBPWRG4
(1)

Status (1) ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE

Package Type PDIP PDIP CDIP CDIP SOIC SOIC SOIC SOIC SOIC SOIC SOIC SOIC SOIC TSSOP TSSOP TSSOP TSSOP TSSOP

Package Drawing N N J J D D D D D D D D D PW PW PW PW PW

Pins Package Eco Plan (2) Qty 14 14 14 14 14 14 14 14 14 14 14 14 14 14 14 14 14 14 25 25 1 1 50 Pb-Free (RoHS) Pb-Free (RoHS) TBD TBD Green (RoHS & no Sb/Br)

Lead/Ball Finish CU NIPDAU CU NIPDAU A42 A42 CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU

MSL Peak Temp (3) N / A for Pkg Type N / A for Pkg Type N / A for Pkg Type N / A for Pkg Type Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM

2500 Green (RoHS & no Sb/Br) 2500 Green (RoHS & no Sb/Br) 2500 Green (RoHS & no Sb/Br) 50 50 250 250 250 90 90 Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br)

2000 Green (RoHS & no Sb/Br) 2000 Green (RoHS & no Sb/Br) 2000 Green (RoHS & no Sb/Br)

The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device.
(2)

Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.

Addendum-Page 1

PACKAGE OPTION ADDENDUM www.ti.com 11-Nov-2009

Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)

MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

Addendum-Page 2

PACKAGE MATERIALS INFORMATION www.ti.com 20-Aug-2010

TAPE AND REEL INFORMATION

*All dimensions are nominal

Device

Package Package Pins Type Drawing SOIC SOIC TSSOP D D PW 14 14 14

SPQ

Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) 330.0 330.0 330.0 16.4 16.4 12.4 6.5 6.5 6.9

B0 (mm) 9.0 9.0 5.6

K0 (mm) 2.1 2.1 1.6

P1 (mm) 8.0 8.0 8.0

W Pin1 (mm) Quadrant 16.0 16.0 12.0 Q1 Q1 Q1

CD4001UBM96 CD4001UBMT CD4001UBPWR

2500 250 2000

Pack Materials-Page 1

PACKAGE MATERIALS INFORMATION www.ti.com 20-Aug-2010

*All dimensions are nominal

Device CD4001UBM96 CD4001UBMT CD4001UBPWR

Package Type SOIC SOIC TSSOP

Package Drawing D D PW

Pins 14 14 14

SPQ 2500 250 2000

Length (mm) 346.0 346.0 346.0

Width (mm) 346.0 346.0 346.0

Height (mm) 33.0 33.0 29.0

Pack Materials-Page 2

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Customers are responsible for their products and applications using TI components. To minimize the risks associated with customer products and applications, customers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. 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