Project Report on Name Class Section Roll No. – Rajarshi Biswas – BEE - IV – A1 – 000610801017 Acknowledgement We are heartily thankful to our supervisors whose encouragement, guidance and support from the initial to the final level enabled me to develop an understanding of the subject. Lastly we offer my regards to all of those who supported me in any respect during the completion of the project especially our guides Prof. P. K. Chattopadhyay, Prof. S. K. Goswami and Prof. R. N
Words: 12102 - Pages: 49
UNIVERSITY OF THE WITWATERSRAND School of Electrical and Information Engineering ELECTRICAL DISCHARGES IN GASES TABLE OF CONTENTS 1. QUESTION 1 2 2. QUESTION 2 11 3. QUESTION 3 21 4. QUESTION 4 28 5. QUESTION 5 36 6. REFERENCES 45 7. APPENDIXTURE 48 1. QUESTION 1 a) Explain the processes which lead to electrical breakdown of air by the streamer mechanism. Your explanation should include a discussion of the influence of pressure, gap length and electric
Words: 10460 - Pages: 42
Oscillators Oscillator: An oscillator is a circuit that generates a repetitive waveform of fixed amplitude and frequency without any external input signal [1, p. 279]. Function of Oscillator: The function of oscillator is to generate alternating current or voltage wave forms such as sinusoidal, square wave, triangular wave, sawtooth wave, etc. Used of Oscillator: Oscillators are used in radio, TV, computers, CRT, Oscillocope, and communications. Types of Oscillator: There are two main types
Words: 5378 - Pages: 22
CHAPTER 14 SIGNAL INTEGRITY* 14.1. Introduction......................................................................................................................................... 2 14.2. SI Problems......................................................................................................................................... 3 14.2.1. Typical SI Problems.................................................................................................................... 3 14.2
Words: 8259 - Pages: 34
1/ ENERGY BANDS IN SOLIDS In this chapter we begin with a review of the basic atomic properties of matter leading to discrete electronic energy levels in atoms. We find that these energy levels are spread into energy bands in a crystal. This band structure allows us to distinguish between an insulator, a semiconductor, and a metal. 1-1 CHARGED PARTICLES The charge, or quantity, of negative electricity and the mass of the electron have been found to be 1.60 X 10- 19 C (coulomb) and 9.11
Words: 63477 - Pages: 254
CORE SYLLABUS for National Eligibility-Cum-Entrance Test (NEET) for Admission to MBBS/BDS Courses The Medical Council of India (MCI) recommended the following syllabus for National Eligibility-cum-Entrance Test for admission to MBBS/BDS courses across the country (NEET-UG) after review of various State syllabi as well as those prepared by CBSE, NCERT and COBSE. This is to establish a uniformity across the country keeping in view the relevance of different areas in Medical Education. PHYSICS
Words: 5244 - Pages: 21
2007-2008 JAWAHARLAL NEHRU TECHNOLOGICAL UNIVERSITY, HYDERABAD B.TECH. ELECTRONICS AND COMMUNICATION ENGINEERING I YEAR COURSE STRUCTURE |Code |Subject |T |P/D |C | | |English |2+1 |- |4 | | |Mathematics - I |3+1 |- |6 | |
Words: 26947 - Pages: 108
THE ORIGINS OF ICE SKATES By Nam Catzel Investigation into the Origins of Ice Skates and their evolution ORIGINS OF ICE SKATES INVESTIGATIONS INTO THE ORIGINS OF ICE SKATES Executive Summary There is much debate in the field of history; conjecture and interpretation of facts are often misinterpreted due to the lack of evidence. The origin of ice skates is subject to much of these misconceptions. Though there have been many interesting and intriguing finds in this area, the
Words: 5466 - Pages: 22
*Physics Prelims (1-7).qxd 12/11/08 1:00 PM Page 1 SCIENCE VISUAL RESOURCES PHYSICS An Illustrated Guide to Science The Diagram Group *Physics Prelims (1-7).qxd 12/11/08 1:00 PM Page 2 Physics: An Illustrated Guide to Science Copyright © 2006 The Diagram Group Author: Derek McMonagle BSc PhD CSci CChem FRSC Editors: Catherine Gaunt, Jamie Stokes Design: Anthony Atherton, Richard Hummerstone, Lee Lawrence, Tim Noel-Johnson, Phil Richardson Illustration: Peter Wilkinson Picture
Words: 78462 - Pages: 314
Through Silicon-Via (TSV) Technology Abstract Increasing demands for electronic devices with superior performance and functionality with longer battery life while reducing their sizes, weights and energy consumption has driven the semiconductor industry to develop more advanced packaging technologies. Among all different types of packaging technologies proposed, three-dimensional (3D) vertical integration (3D stacking of chips) using through silicon via (TSV) copper interconnect is currently
Words: 2618 - Pages: 11
