...Silicon wafer is a thin slice of silicon crystal used in the fabrication of integrated circuits and other micro devices. Silicon is widely used in the semiconductor industry because it remains a semiconductor at higher temperatures than other semiconductor materials and because its native oxide is easily grown. Once grown its native oxide forms a better semiconductor/dielectric interface than other materials. The purpose of this article is to give a brief and basic explanation of the many different silicon wafer options available. If you are interested in purchasing any quantity of silicon wafers then Mi-Net Technology Ltd will be able to help. Please contact us for further information. Quality There are different qualities of silicon wafer available. The main qualities are PRIME, MONITOR and TEST. Prime wafers are wafers of top quality. They will generally be extremely flat and have a very low variation in thickness across the entire wafer. These wafers will be extremely clean and have a very low number of defects. Monitor and test wafers are used less for final manufacturing and more for research and quality control. They are not as clean or as flat as a prime wafer and may have many more defects across the wafer. They will however be cheaper. Growth Methods There are two common growth methods for silicon wafers. These are Czochralski and Float Zone. In the Czochralski method, high purity semiconductor grade silicon is melted down into a crucible. A quantity...
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...David Chiu IEOR 130 HW#1 Assignment 5 September 2014 1.) a.) Wafer Fab: A fabrication plant that carries out wafer fabrication process and wafer probe. b.) Die Sort: First special electrical structures are tested to verify the proper electrical characteristics on a wafer. Afterwards each of the individual chips on each wafer is tested with a fully functional test to sort the good and failed chips on a wafer. c.) Die Bank: An inventory point of unassembled sorted die. The place where they hold product pending specific customer demand for finished goods. d.) Assembly: Dice up the completed wafer and package the chips in plastic or ceramic housings with electrical leads e.) Test: Full functional test of the packaged device at various temperatures (“device test”), branding device ID, high-temperature operation (“burn-in”) followed by re-test, packing for shipment f.) Line Yield: The fraction of wafers surviving the fab process flow g.) Die Yield: The fraction of chips on a completed wafer that function at wafer probe. h.) Overall Equipment Efficiency (OEE): The “should-take” time for the work actually completed divided by the total time. i.) Die or chip: a small block of semiconducting material, on which a given functional circuit is fabricated. Integrated circuit on a wafer. j.) Cycle Time: The time it takes manufacturing lots to pass through the entire production process. h.) Bottleneck: a phenomenon where the performance or capacity of an...
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...Shoufeng, Hualien 97401, Taiwan. E-mail: cn_chen@ mail.ndhu.edu.tw DRAM, considered as strategic materials of the electronics industry, is like water and cannot be monopolized by Korea. Global technology companies pay much attention to how the Taiwan government supports its DRAM industry. Taiwan DRAM industry is still likely to be profitable if the Taiwan government considers its investment cautiously to help DRAM companies merge or transform1. — Frank Huang CEO of Powerchip Semiconductor Corporation Dynamic random access memory (DRAM) production and wafer foundries became two major pillars in Taiwan’s semiconductor industry beginning in the 1980s. Mosel Electronics, founded in 1987, and Acer Semiconductor Manufacturing, founded in 1989, were among the early DRAM firms in Taiwan. United Microelectronics Corporation (UMC), founded in 1980, and Taiwan Semiconductor Manufacturing Company (TSMC), founded in 1987, were among the early wafer foundry firms in Taiwan. In 1991 Mosel Vitelic Inc. was established through a merger of Mosel Electronics and Vitelic to develop its DRAM products actively with its establishment of the 6-inch fab in 1993; thus it was the first DRAM manufacturer in Taiwan. During the years 1993–1995, the DRAM market boom and supply shortages...
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...9-713-406 REV: DECEMBER 2, 2013 JUAN ALCÁCER KERRY HERMAN Intel: Strategic Decisions in Locating a New Assembly and Test Plant (A) Government incentives can come and go. Decisions need to be long term. — Brian Krzanich, Intel general manager Assembly Test (2005) Brian Krzanich, Intel general manager of Assembly Test (AT), looked through his deck of slides one more time. It was March 2005, and in a few days, he would present the AT team’s proposal for the siting of its next AT factory to Intel’s board. The new facility would be Intel’s largest AT plant to date, doubling the size of any existing AT plant and providing the company with more efficient capacity. In 2005, industry average costs to build a new AT factory ran about $80 million with annual operating costs of between $150 and $300 million. He thought back to the fall of 2001, when Intel’s global site selection team had first started gathering data on possible sites for a new AT plant. There were a host of considerations implicated in this proposal, with operational and strategic dynamics as well as national and international relationships at stake. In their preliminary study of possible sites, Krzanich and his team had focused primarily on Asian and South East Asian locations, given that between 2002 and 2005, the total cost of operations in these countries were still the lowest in the world, and these markets represented important and growing opportunities for Intel. While U.S. regulations had prohibited...
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...Tablets LED Electronics Market by segment Consumer Electronics Set Top Boxes Automotive Electronics Medical Electronics 34 34 35 29 10 10 8.5 * US$ Billions Conducive Policy Environment Infrastructure, Incentives, Innovation National Policy on Electronics, 2012 Holistic, Investor-friendly, Market-driven NPE Vision 2020 “To create a globally competitive electronics design and manufacturing industry to meet the country's needs and serve the international market” Investment : US$ 100 Bil Production : US$ 400 Bil Employment : 28 Mil NPE 2012 : A Holistic Approach I II III • Electronics Manufacturing Cluster Scheme (EMC) • Modified Special Package Incentive Scheme (M-SIPS) • Setting up of Semi-conductor Wafer Fab in India IV V VI • Preferential Market Access • Electronics Development Fund (EDF) • Mandating Safety Standards • Human Resource Development VII Electronics Manufacturing Clusters Infrastructure Development • Roads • Power • Water • ETP’s • Testing facilities • Social Infrastructure • Subsidy upto ~USD 10 mil per 100 acres of land • Applicable to both Greenfield and Brownfield projects...
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...Title Investigating a Problem and Refining a Solution Assessment Part A: Investigating and Rating Sources of Information Is the website from Kathleen credible? ☐ The website from Kathleen is credible. ☑ The website from Kathleen is not credible. Is the website from Kathleen relevant? ☐ The website from Kathleen is not relevant. ☐ The website from Kathleen is somewhat relevant. ☑ The website from Kathleen is highly relevant. Is the survey from Martine credible? ☐ The survey from Martine is credible. ☑ The survey from Martine is not credible. Is the survey from Martine relevant? ☐ The survey from Martine is not relevant. ☑ The survey from Martine is somewhat relevant. ☐ The survey from Martine is highly relevant. Is Naureen's story credible? ☑ Naureen's story is credible. ☐ Naureen's story is not credible. Is Naureen's story relevant? ☐ Naureen's story is not relevant. ☑ Naureen's story is somewhat relevant. ☐ Naureen's story is highly relevant. Is the American Medicine article credible? ☑ The American Medicine article is credible. ☐ The American Medicine article is not credible. Is the American Medicine article relevant? ☑ The American Medicine article is not relevant. ☐ The American Medicine article is somewhat relevant. ☐ The American Medicine article is highly relevant. Is the article from Deanne credible? ☑ The article from Deanne is credible. ☐ The article from Deanne is not credible. Is...
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...Title Investigating a Problem and Refining a Solution Assessment Part B: Identify the Steps and Refine a Solution to a Problem Policy A: Issue – The policy is highly invasive of student privacy Decide what action should be taken Recognize and overcome difficulties Policy B: Problem – This policy is too weak to be effective Work out details Find imperfections in policy Overcome imperfections in the policy Assessment Part A: Investigating and Rating Sources of Information Is the website from Kathleen credible? ☐ The website from Kathleen is credible. ☑ The website from Kathleen is not credible. Is the website from Kathleen relevant? ☑ The website from Kathleen is not relevant. ☐ The website from Kathleen is somewhat relevant. ☐ The website from Kathleen is highly relevant. Is the survey from Martine credible? ☐ The the survey from Martine is credible. ☑ The the survey from Martine is not credible. Is the survey from Martine relevant? ☐ The survey from Martine is not relevant. ☑ The survey from Martine is somewhat relevant. ☐ The survey from Martine is highly relevant. Is Naureen's story credible? ☑ Naureen's story is credible. ☐ Naureen's story is not credible. Is Naureen's story relevant? ☑ Naureen's story is not relevant. ☐ Naureen's story is somewhat relevant. ☐ Naureen's story is highly relevant. Is the American Medicine article credible? ☑ The American Medicine article is credible. ☐ The American Medicine...
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...Resolving a Problem Trying to refine a problem can take time and consideration. The text gives three basic steps to help that with hard work and patience is not difficult to complete. The three steps involved: working out the details of the solution, finding imperfections and complications, and making improvements (Ruggiero, 2009). Along with the time and consideration, the problems at hand are resolved. The original problem is finding a considerable and family oriented church to attend. Focusing on some of the problems that the churches have along with me it has been hard to get into a church feeling comfortable enough to attend. While, taking the process to evaluate my thoughts, research current and past complications in the churches, and satisfaction of others currently attending these churches; I was doing a personal evaluation in the churches every Sunday. This one the way to find answers to several questions such as are the churches family-oriented, do they keep one’s attention during a sermon; are the too large or small. These are just some of the major concerns when trying to figure out which church was best and why the others did not meet that satisfaction level. When the information had been gathered the comparisons were made. The decisions of why one church did not compete with the other became clearer. The way to refine the problem would be to stop looking for the problems with the churches and start looking for the positive aspects....
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...22 (P226) A purchasing agent for a particular type of silicon wafer used in the production of semiconductors must decide among three sources. Source A will sell the silicon wafers for $2.50 per wafer, independently of the number of wafers ordered. Source B will sell the wafers for $2.40 each but will not consider an order for fewer than 3,000 wafers, and Source C will sell the wafers for $2.30 each but will not accept an order for fewer than 4,000 wafers. Assume an order setup cost of $100 and an annual requirement of 20,000 wafers. Assume a 20 percent annual interest rate for holding cost calculations. a. Which source should be used, and what is the size of the standing order? b. What is the optimal value of the holding and setup costs for wafers when the optimal source is used? c. If the replenishment lead time for wafers is three months, determine the reorder point based on the on-hand level of inventory of wafers. Ans: = 20,000 K = 100 I = .20 All Units Discount c0 = $2.50 c1 = $2.40 c2 = $2.30 a. Q Q Q (0) (1) (2 = 2K 1c0 = 2K 1c1 2K 1c2 = (2)(100)(20,000) (.20)(2.50) (2)(100)(20,000) (.2)(2.40) (2)(100)(20,000) (.2)(2.30) = 2828 = 2887 = 2949 0 only Q is realizable. (Figure 11 is accurate with different breakpoints.) Cost at Q = 4,000 (20,000)(2.30) + (.2)(2.30)(4,000) (100)(20,000) 2 (4, 000) = $47,420 Cost at Q = 3,000 (20,000)(2.40) + (.2)(2.40)(3,000) (100)(20...
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...the challenging task of choosing investment options for the division, ensuring sustainability and increased market share for the company over the next five years. Kirk is faced with several alternatives, which include: 1. Maintain the status quo, and having the Bromont plant continue to use 100mm wafers. 2. Convert Bromont to larger wafers, 150mm, 200mm, or 300mm. 3. Contract out fabrication to other facilities. 4. Increase capacity through the acquisition of other semiconductor facilities. Considerations There are several factors which need to be taken into consideration, outside of the alternatives themselves. One such factor is that, due to Mitel past financial failures, the corporation has a policy that over the long term, business must be able to finance their own growth. Therefore the company is in opposition to further debt and only available cash and cash equivalents can be used for investments. A 15 percent cost of capital is utilized in comparing alternatives. Another factor is its current supplier of 100mm wafers has stated that it is increasing to larger sizes and will no longer be able to meet the demands at Mitel for 100mm wafers. This is coupled with an issue of ageing equipment at the Bromont facility, which is becoming increasingly more expensive to maintain and difficult to procure...
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...The co-founders of the company, 1366 technologies, Ely Sachs and Frank van Mierlo, have a choice in order to place their company in a lea dining position in the world-wide solar industry. The first option available to the company is to expand its business operations in order to produce the silicon wafers itself and in order to do that, the management of the company would raise the required financing from the later stage growth equity investors or from the Department of energy. The manufacturing of the wafers would be done by the company in the United States and then it would export those wafers to the Asian cell manufactures. On the other hand, the second option for 1366 Technologies was to go for a licensing agreement or a joint venture. Through this partnership approach, the company would rapidly gain scaling and it would also allow the Asian partners to lower their costs of production. The management of the company has always supported the accelerated growth however; the company might face significant risks if the intellectual property is exposed to the wrong partners. If the management of the company considers this option, it would lose its technology however, looking at the pace of innovation in the industry and the changes in the solar industry caused by the active involvement of the governments, Sachs and van Mierlo knew that they could not win the race by being cautious. First of all, if we interpret the Levelized cost of energy (LCOE) comparison and its sensitivity...
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...1 Executive Summary In 1971, Michael Cowpland and Terry Matthews incorporated and formed the company Mitel. They achieved immediate success with products that were composed of semiconductors, while they also sold semiconductors. They quickly achieved market dominance in the communications sector. As the communications sector became increasingly regulated by government, some of Mitel’s major customers lost market share resulting in fewer sales for Mitel. This resulted in Mitel’s competitors advancing ahead of them in industry dominance. Over time, Mitel was sold and resold with its share value increased, decreased, and then increased again but to only a fraction of what it used to be. Mitel continued to be a company that stayed rooted to its initial specialities in the communications industry. As other sectors developed to the extent that the communications sector only occupied 0.5 per cent of the overall market, Mitel has been unable to diversify such that its future is again dependant on unforeseen changes in the industry. It is critical that Mitel achieve the ability to secure product to enable further product development and enhance its research and development so it may diversify its products and balance its products among various markets, so that event changes in a particular market will not compromise the entirety of Mitel. 2 Overview In the 1960s, semiconductors were developed and quickly became the “backbone of all electronic devices. Consumer electronics...
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...to Computer Organizatikns & Architecture Dr. Y. Kim Feburary 25, 2015 Did you know that microprocessors today have more than 30 layers of complex circuits compared to the 5 layered circuit discovered in 1971? Silicon chips are also known as a monolithic integrated circuits, die, or processors. They’re miniature electronic brains that are everywhere in the electronic world, which processes data in the form of electrical currents traveling along a circuit. The natural semi-conductor of integrated chips is manufactured using sand. Beach sand contains a high percentage of the principal ingredient, silica or silicon dioxide, the most abundant element on earth besides oxygen. The process of making silicon chips is called fabrication. A wafer is a thin silicon disk sliced from a cylindrical ingot that is used as the principal ingredient for building integrated circuits. The creation of silicon chips is processed by ensuring product specifications, architectural specifications, creating a logic design, compose a physical representation and finalizations. However, engineers experience a problem with desiring to make electronic devices simpler but more powerful. Although the first computers came about before its invention, the silicon microprocessor is the advancement that made the modern computer era explode. The ability to create a microelectric chip out of silicon dioxide was what triggered computers best advancements in energy efficiency and performance. The first microprocessor...
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...------------------------------------------------- University of Oklahoma EMBA5072Corporate Finance TEAM 6 – Karen Waldrip, Atjen Shasivari, Keith Albright ------------------------------------------------- University of Oklahoma EMBA5072Corporate Finance TEAM 6 – Karen Waldrip, Atjen Shasivari, Keith Albright 1366 Technologies-Scaling the Venture 1366 Technologies-Scaling the Venture EXECUTIVE SUMMARY 1366 Technologies (“1366”) is a Massachusetts-based solar energy 2007 start-up that is developing a series of innovations to drive down the levelized cost of solar electricity. Its first target is the wafer with its Direct Wafer™ technology which has the potential to revolutionize wafer manufacturing by eliminating process steps, time, and waste with a refined, scalable process. 1366 Technologies’ eliminates the cost and production challenges that have hampered solar power’s ability to replace fossil fuels. The company combines breakthrough innovations in silicon cell architecture with lean manufacturing processes to make the world’s most cost effective and commercially viable high efficiency solar cells. Developed by a veteran team of scientists led by world renowned inventor, Ely Sachs, and its co-founder and CEO, Frank van Mierlo, the company’s innovative approach breaks the historic efficiency and cost tradeoff of solar photovoltaics. 1366 Technologies’ initial investment (Series A) financing came at the end of 2007 from venture capitalists and it received $3...
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...Electronic Design Automation and the Design of Integrated Circuits Abstract A circuit, simply put, is defined as a complete path around which an electric current can flow in order to complete a predesigned task. Circuit design is the intermediate process by which electrical circuits are moved from the specification stage - where the circuit’s purpose is determined - to the production stage, where all of the information necessary to build a working circuit is ready for implementation. In order to keep up with demand for consumer electronics, a fast and efficient way to design and construct the myriad types of circuitry must be in place. This essay will illustrate the basics of circuit design and describe the automated circuit design process. Electronic Design Automation In a large part of the world, electronics are a mainstay of modern society. In the beginning, electronics were much more simple in design, but with the caveat of being much larger today: in the 1980s cellular phones weighed upwards of two pounds and were about three times the size of modern cell phones. Over time, as electronics became smaller and as demand for them increased, a way to design and construct smaller and more efficient circuits became necessary. Enter Electronic Design Automation. An electric circuit is an electrical path that provides a path for an electrical current to flow. While it may seem like a simple matter to design and construct a circuit, the process has become quite intensive...
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