...At this time, unfortunately, a convergence in terminology has not been forthcoming and, hence, a definition of the term Micro-Machining to be implied in the context of this assessment is in order. In principle, one may take two viewpoints:(1) The first viewpoint may define Micro-Machining as the collection of all cutting operations that are performed on micro/meso-scale components and products that fall into the 100 μm to 10,000 μm size range as shown in the figure below. The Micro-Machining regime is characterized by the requirement of producing high accuracy complex geometric features in a wide variety of materials in the above-defined size range. These requirements impose the use of considerably downsized tooling (micro-tools, e.g. endmills in the 50 to 500 micron diameter range), small undeformed chip thicknesses and feedrates (submicron to a few microns) and speed settings (50K to 200K RPM might not be uncommon) that would be considered technologically infeasible at the conventional macro-scale. As a consequence, the principal distinction between Macro and Micro-Machining operations emerges and manifests itself as the dominance of ploughing and rubbing phenomena at the cutting edge over shearing and the necessity to take micro-structural effects into consideration. (2) The second viewpoint approaches the definition of the Micro-Machining regime from the standpoint of the magnitude of the undeformed chip thickness being removed in the cutting process. It is difficult to define...
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...sensors and actuators, as these are bulkier and less reliable than the microelectronic circuit. In a MEM system the sensors act as the ‘eyes’ and gather data about the environment. The microelectronic circuit, which is the ‘brain’, processes the data and accordingly controls the mechanical systems, the ‘arms’ of the MEMS, to modify the environment suitably. The electronics on the MEMS are manufactured using IC techniques while micro machining techniques are used to produce the mechanical and electromechanical parts. MEMS Fabrication: There are number of methods to fabricate MEMS like silicon surface micromachining, silicon bulk machining, electro discharge machining, LIGA (in German, Lithographie, Galvanoformung(Electro Plating), Abformung(Injection Moulding)) .Only silicon surface micromachining is discussed here. Silicon Surface Micromachining Silicon surface micromachining uses the same equipment and processes as the electronics semiconductor industry. There are three basic building blocks in this technology, which are the ability to deposit thin films of material on a substrate, to apply a patterned mask on top of the films by photolithographic imaging, and to etch the films selectively to the mask. A MEMS process is usually a structured sequence of these operations to...
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...CHAPTER-1 INTRODUCTION Microelectromechanical systems (MEMS) are small integrated devices or systems that combine electrical and mechanical components. They range in size from the sub micrometer level to the millimeter level and there can be any number, from a few to millions, in a particular system. MEMS extend the fabrication techniques developed for the integrated circuit industry to add mechanical elements such as beams, gears, diaphragms, and springs to devices. Examples of MEMS device applications include inkjet-printer cartridges, accelerometer, miniature robots, microengines, locks inertial sensors microtransmissions, micromirrors, micro actuator (Mechanisms for activating process control equipment by use of pneumatic, hydraulic, or electronic signals) optical scanners, fluid pumps, transducer, pressure and flow sensors. New applications are emerging as the existing technology is applied to the miniaturization and integration of conventional devices. These systems can sense, control, and activate mechanical processes on the micro scale, and function individually or in arrays to generate effects on the macro scale. The micro fabrication technology enables fabrication of large arrays of devices, which individually perform simple tasks, but in combination can accomplish complicated functions. MEMS are not about any one application or device, nor are they defined by a single fabrication process or limited to a few materials. They are a fabrication approach that conveys...
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...EXPERIMENTAL STUDY OF MICRO ULTRASONIC MACHINING PROCESS Sreenidhi Cherku, Murali M Sundaram, and K P Rajurkar Center for Nontraditional Manufacturing Research University of Nebraska-Lincoln Lincoln, Nebraska, USA INTRODUCTION Micro ultrasonic machining (micro USM), is one of the efficient material removal processes especially suitable for the micromachining of hard and brittle materials. The principle of micro USM is shown in Figure 1. In micro USM workpiece which is placed on the workpiece table vibrates at ultrasonic frequency (40 KHz). Abrasive slurry is injected on the top of the workpiece. There is a rotating tool which hits the abrasive particles in the slurry which in turn hit the workpiece and chip away the material from it. The vibrations given to the workpiece aid in refreshing the slurry so that fresh abrasive particles are in contact with the workpiece and also in removing the debris from the tool workpiece gap [1-4]. In many conventional machining processes like grinding, milling and broaching processes oil has been successfully used as cutting fluid. These oils can be used either as straight oils, which are pure petroleum based oils or emulsifiers which are water based oils. Use of straight oils have excellent lubricating properties and are used especially for machining process involving low speeds, low clearance requiring high quality surface finish. These oils have more viscosity and good lubricating properties than water...
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...the foundation of this technology. But it has come across many decades over different industries. This technology was already used by the nature before this concept come to the world. The best example for this is the surface of the leaves of lotus flowers. In 1959 a suggestion came by a great physicist about building object in atomic size. He was Richard Feynman who directed the world into different path over nanotechnology. In 1970 a revolution was done by Eric Drexler by inventing molecular manufacturing. It was the start of understanding that a very powerful technology can be introduced. In 1986 this person introduced the word “nanotechnology” to the industry. Some researchers state that this word was previously used in Japan for micromachining. However in 1992 Eric Drexler was able to publish nanosystems which is a technical process of creating machines with high performance. Properties which are unique to nanotechnology • Nano particles are very small dimension and lightweight • Large surface areas can be covered. • Used to create high functional, high sensitive devices. • Use in high strength materials. Eg: nanofibers • Quantum effects Figure 1 – Different nano structures ...
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...ME3281 Microsystems Design and Applications TERM PAPER DEPARTMENT OF MECHANICAL ENGINEERING MEMS Energy Harvesters LIM HUI HUA ALVINA A0083044M 2014 Table of Contents 1. Introduction: 2 2. Brief History of Electricity Transduction 2 3. Types of Micro Energy Harvesters 3 3.1 Energy Harvesting from Vibration 3 3.1.1 Fabrication Techniques 5 3.1.2 Applications, Challenges and the Future 6 3.2 Energy Harvesting from Thermal Sources 6 3.2.1 Fabrication Techniques 8 3.2.2 Applications, Challenges and the Future. 9 3.3 Energy Harvesting from Electromagnetic Waves 10 3.3.1 Applications, Challenges and the Future 11 3.4 Energy Harvesting from Light Sources 11 3.4.1 Fabrication 12 3.4.2 Applications, Challenges and the Future 13 4. Conclusion 13 References: 14 1. Introduction: One of the goals of engineers and scientists in this already tech-savvy age is to be able to design a device that is capable of powering itself for its lifetime without having to replace or recharge its battery using a power chord. These allow remote devices to be placed in hostile or inaccessible environments without requiring any or little maintenance such as the changing of batteries. This is especially applicable for silicon-based electronics, such as biomedical implants that have low power consumption, where batteries will largely affect its size; operational cost of the device, or perhaps even release harmful chemicals into the body. In addition, wireless sensor...
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...Journal of Manufacturing Systems, 2005. 4. “Characterization of aqueous ferric chloride etchant used in industrial photochemical machining” David M. Allen, Heather J.A. Almond, Journal of Material Processing Technology 149,pages 238-245, 2004. 5. “Cost of photochemical Machining’’, Rajkumar Roy, David Allen, Oscar Zamora, Journal of Material Processing Technology, 149,pages 460-465,2004. 6. “A new etchant for the chemical machining of St304”, A. Fadaei Tehrani, E. Imanian, Journal of Materials Processing Technology 149, 404–408, 2004. 7. “Increasing utilization efficiency of ferric chloride etchant in industrial photochemical machining” David M. Allen, Heather J.A. Almond, J. Environ. Monit. ,pages 103–108, 1999. 8. “MEMS Micromachining Technology-Photochimical Machining”, Dr. P. K. Bharmankar , Dr. M. Sadaiah , Mr. N.D....
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...INTERNATIONAL JOURNAL ON SMART SENSING AND INTELLIGENT SYSTEMS, VOL. 3, NO. 4, DECEMBER 2010 Microcontroller based Power Efficient Signal Conditioning Unit for Detection of a Single Gas using MEMS based Sensor P. Bhattacharyya*, D. Verma and D.Banerjee Department of Electronics and Telecommunication Engineering, Bengal Engineering and Science University, Shibpur- 711103, Howrah, West Bengal, India *Corresponding author: Tel.: +913326684561; fax: +913326682916 E-mail: pb_etc_besu@yahoo.com Abstract-A low power MEMS based sensor along with the embedded power efficient signal conditioning unit (Microcontroller based), which can be used with any suitable sensor-network to detect and quantify variations in a particular gas concentration, has been reported in this paper. The power consumption of the MEMS gas sensor is ~ 70mW to 100mW depending upon its operating temperature (150-250°C) and that of entire signal conditioning unit (consisting of low noise amplifier, switch, microcontroller and power management chip) is ~ 36mW in the ON state and only ~7.2µW in OFF state (sleep mode). The test gas in this particular case was methane for which sensor resistance varied from 100KΩ to 10KΩ. This hybrid sensor system is very much suitable for detecting a single gas with display of corresponding gas concentrations and subsequent alarming if the threshold limit is crossed. Index terms: MEMS, Gas sensor, Low power, Microcontroller, Signal Conditioning I. INTRODUCTION A Signal-conditioning...
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...tayal@gmail.com) ABSTRACT Through this paper we report a new atomic force microscope (AFM)-based data storage concept called the “Millipede” that has a potentially ultrahigh density, terabit capacity, small form factor, and high data rate. Its potential for ultrahigh storage density can be used as a technique to store and read back data in very thin polymer films. With this new technique, 3040-nm-sized bit indentations of similar pitch size have been made by a single cantilever/tip in a thin (50-nm) polymethylmethacrylate (PMMA) layer, resulting in a data storage density of 400-500 Gb/in.2 High data rates are achieved by parallel operation of large two-dimensional (2D) AFM arrays that have been batch-fabricated by silicon surface-micromachining techniques. The very large scale integration (VLSI) of micro devices (cantilevers/tips) on a single chip leads to the largest and densest 2D array of 32 x 32 (1024) AFM cantilevers with integrated write/read storage functionality ever built. Timemultiplexed electronics control the write/read storage cycles for parallel operation of the Millipede array chip. Initial areal densities of 100-200 Gb/in.2 have been achieved with the 32 × 32 array chip, which has potential for further improvements. In addition to data storage in polymers or other media, and not excluding magnetics, we envision areas in nanoscale science and technology such as lithography, high-speed/large-scale imaging, molecular and atomic manipulation, and many others in...
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...332 IEEE SENSORS JOURNAL, VOL. 1, NO. 4, DECEMBER 2001 Inertial Sensor Technology Trends Neil Barbour and George Schmidt, Senior Member, IEEE Abstract—This paper presents an overview of how inertial sensor technology is applied in current applications and how it is expected to be applied in near- and far-term applications. The ongoing trends in inertial sensor technology development are discussed, namely interferometric fiber-optic gyros, micro-mechanical gyros and accelerometers, and micro-optical sensors. Micromechanical sensors and improved fiber-optic gyros are expected to replace many of the current systems using ring laser gyroscopes or mechanical sensors. The successful introduction of the new technologies is primarily driven by cost and cost projections for systems using these new technologies are presented. Externally aiding the inertial navigation system (INS) with the global positioning system (GPS) has opened up the ability to navigate a wide variety of new large-volume applications, such as guided artillery shells. These new applications are driving the need for extremely low-cost, batch-producible sensors. Index Terms—Accelerometer, gyroscope, inertial, MEMS. I. INTRODUCTION LECTROMECHANICAL inertial sensors have generally dominated guidance, navigation, and control applications since the dawn of inertial sensing in the early 1920s [1]–[4]. In recent years, however, new technologies have enabled other kinds of sensors that are challenging and have successfully...
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...MICRO-STEREOLITHOGRAPHY Authors : Ruchita Kulkarni, Kedar Malusare _____________________________________________________________________________ 1. INTRODUCTION 1.1 Rapid prototyping Rapid Prototyping (RP) can be defined as a group of techniques used to quickly fabricate a scale model of a part or assembly using three-dimensional computer aided design (CAD) data. What is commonly considered to be the first RP technique, Stereolithography, was developed by 3D Systems of Valencia, CA, USA. The company was founded in 1986, and since then, a number of different RP techniques have become available. Rapid Prototyping has also been referred to as solid free-form manufacturing; computer automated manufacturing, and layered manufacturing. RP has obvious use as a vehicle for visualization. In addition, RP models can be used for testing, such as when an airfoil shape is put into a wind tunnel. RP models can be used to create male models for tooling, such as silicone rubber molds and investment casts. In some cases, the RP part can be the final part, but typically the RP material is not strong or accurate enough. When the RP material is suitable, highly convoluted shapes (including parts nested within parts) can be produced because of the nature of RP. Fig 1. Rapid prototyping worldwide There is a multitude of experimental RP methodologies either in development or used by small groups of individuals. They are listed as given below. Stereolithography (SLA) Selective Laser...
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...Table of Contents 1.0 Abstract 2 2.0 Introduction 3 3.0 Objective of the case-study 5 4.0 Literature Review 6 4.1 The Corporate Kitchen 6 4.2 Recipe 7 4.3 Finished dish 7 5.0 Result and discussion 8 5.1 MEMSTECH 8 Enter the corporate kitchen 8 The cooking recipes. 14 The finished dish 15 6.0 Conclusion 17 Appendix 18 Bibliography 19 Abstract Financial statement fraud is a very costly type of fraud and has a significant financial impact on the company businesses and also individuals, as well as influence investor confidence in the markets. In this project, our group will going to present on a case study in Financial Statement Fraud by a company that we choose. First of all, in this report we will investigate on our background of the Case Study Company which is MEMS TECHNOLOGY BHD. In the case study, we will determine the current status of the company and how the financial statement fraud will give impact to the organization by referring to the company’s annual report 2009. Hence, in this report we will give some practical guide on the different schemes and components that are used for detection on the Financial Statement Fraud that might be probably incurred in the company annual report 2009. 2.0 Introduction Financial reporting frauds and earnings manipulation have attracted high profile attention recently. The generally accepted definition of the financial statement fraud is the deliberate...
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...A REVIEW OF FLUIDIC SELF ASSEMBLY Towards the fulfillment of course requirement for EE5171 Under Prof. Stephen Campbell Electrical and Computer Engineering University of Minnesota, Twin Cities By: Manan M Dedhia ID # 4279398 M.S. Graduate student Electrical and Computer Engineering University of Minnesota, Twin Cities THE INTEGRATION of microelectromechanical systems(MEMS) sensors and actuators with other classes of microcomponents—electronic, optical, and fluidic—onto a single substrate has the potential to create powerful and complex microsystems. To increase device performance and thus realize the potential of microsystems, it is now accepted that the integration must occur at the micro scale. There are two possible routes: either the micro-components are fabricated at their desired locations in a single process, or they are fabricated separately and then positioned using micro assembly techniques. Since many classes of micro components cannot be co-fabricated effectively due to materials and process incompatibilities, several research groups are developing micro assembly approaches. In the micro assembly route, different classes of micro components are fabricated in separate processes, removed from their substrates, and assembled onto a target substrate of choice. For most applications, sub micrometer positioning and methods for establishing high-quality mechanical and electrical connections to the substrate are required. As in co fabrication, small-area electrical...
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...OPTIMIZATION OF TWO DIMENSIONAL PHOTONIC CRYSTAL BAND GAP USING INDIUM PHOSPHIDE(InP) A thesis submitted in partial fulfilment of the requirements of Staffordshire University for the degree of Master of Science in Electronics Engineering Faculty of Computing, Engineering & Technology DECEMBER 2010 ABSTRACT Photonic crystals exhibit periodic structure and these are of many types such as one, two and three dimensional photonic crystals. Photonic crystal is a low loss periodic dielectric medium. In order to cover all periodic directions the gap must be extend to certain length which is equivalent to semiconductor band gap. The complete photonic band gap occurs in the three dimensional photonic crystals. The propagation of light which is confined to a particular direction can be analysed through Maxwell’s approach. The electromagnetic wave which contains both ‘E’ and ‘H’ fields can be calculated through these equations. These field vectors are more useful in calculating band structure of photonic crystal. This report deals with the calculation of band structure in two-dimensional photonic crystal. There are many methods for calculating band structure and this thesis is mainly focused on the plane wave expansion method. This report contains the simulation procedure for calculating band structure for both TE and TM modes in the presence of dielectric medium using Computer Simulation Technology (CST) microwave studio. Results which are obtained during the simulation provide...
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...NATIONAL INSTITUTE OF TECHNOLOGY SILCHAR Bachelor of Technology Programmes amï´>r¶ JH$s g§ñWmZ, m¡Úmo{ à VO o pñ Vw dZ m dY r V ‘ ñ Syllabi and Regulations for Undergraduate PROGRAMME OF STUDY (wef 2012 entry batch) Ma {gb Course Structure for B.Tech (4years, 8 Semester Course) Civil Engineering ( to be applicable from 2012 entry batch onwards) Course No CH-1101 /PH-1101 EE-1101 MA-1101 CE-1101 HS-1101 CH-1111 /PH-1111 ME-1111 Course Name Semester-1 Chemistry/Physics Basic Electrical Engineering Mathematics-I Engineering Graphics Communication Skills Chemistry/Physics Laboratory Workshop Physical Training-I NCC/NSO/NSS L 3 3 3 1 3 0 0 0 0 13 T 1 0 1 0 0 0 0 0 0 2 1 1 1 1 0 0 0 0 4 1 1 0 0 0 0 0 0 2 0 0 0 0 P 0 0 0 3 0 2 3 2 2 8 0 0 0 0 0 2 2 2 2 0 0 0 0 0 2 2 2 6 0 0 8 2 C 8 6 8 5 6 2 3 0 0 38 8 8 8 8 6 2 0 0 40 8 8 6 6 6 2 2 2 40 6 6 8 2 Course No EC-1101 CS-1101 MA-1102 ME-1101 PH-1101/ CH-1101 CS-1111 EE-1111 PH-1111/ CH-1111 Course Name Semester-2 Basic Electronics Introduction to Computing Mathematics-II Engineering Mechanics Physics/Chemistry Computing Laboratory Electrical Science Laboratory Physics/Chemistry Laboratory Physical Training –II NCC/NSO/NSS Semester-4 Structural Analysis-I Hydraulics Environmental Engg-I Structural Design-I Managerial Economics Engg. Geology Laboratory Hydraulics Laboratory Physical Training-IV NCC/NSO/NSS Semester-6 Structural Design-II Structural Analysis-III Foundation Engineering Transportation Engineering-II Hydrology &Flood...
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